Tsai; Yi Heng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Yi Heng.The latest application filed is for "integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device".
Company Profile
9.32.33
- Tsai; Yi Heng - Hsinchu TW
- Tsai; Yi Heng - Hsin-Chu TW
- TSAI; YI-HENG - HSINCHU CITY TW
Patent Activity
| Patent | Date |
|---|---|
| Reduction of electric field enhanced moisture penetration by metal shielding Grant 11,289,568 - Shih , et al. March 29, 2 | 2022-03-29 |
| Integration Scheme For Breakdown Voltage Enhancement Of A Piezoelectric Metal-insulator-metal Device App 20210383972 - Lin; Anderson ; et al. | 2021-12-09 |
| Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device Grant 11,107,630 - Lin , et al. August 31, 2 | 2021-08-31 |
| Hybrid Ultrasonic Transducer And Method Of Forming The Same App 20210193904 - TSAI; YI HENG ; et al. | 2021-06-24 |
| Hybrid Ultrasonic Transducer And Method Of Forming The Same App 20210078857 - TSAI; YI HENG ; et al. | 2021-03-18 |
| Hybrid ultrasonic transducer and method of forming the same Grant 10,944,041 - Tsai , et al. March 9, 2 | 2021-03-09 |
| Semiconductor Structure And Method For Fabricating The Same App 20200346926 - SHEN; WEI-CHENG ; et al. | 2020-11-05 |
| Semiconductor structure and method for fabricating the same Grant 10,737,936 - Shen , et al. A | 2020-08-11 |
| Integrated Heater (and Related Method) To Recover Degraded Piezoelectric Device Performance App 20200098969 - Kalnitsky; Alexander ; et al. | 2020-03-26 |
| Novel Integration Scheme For Breakdown Voltage Enhancement Of A Piezoelectric Metal-insulator-metal Device App 20200098517 - Lin; Anderson ; et al. | 2020-03-26 |
| MEMS Structure and Method of Forming Same App 20200067425 - Tsai; Yi Heng ; et al. | 2020-02-27 |
| MEMS structure and method of forming same Grant 10,541,627 - Tsai , et al. Ja | 2020-01-21 |
| Reduction Of Electric Field Enhanced Moisture Penetration By Metal Shielding App 20200006469 - Shih; Chi-Yuan ; et al. | 2020-01-02 |
| Semiconductor structure and manufacturing method thereof Grant 10,087,071 - Wu , et al. October 2, 2 | 2018-10-02 |
| MEMS Structure and Method of Forming Same App 20180145612 - Tsai; Yi Heng ; et al. | 2018-05-24 |
| Semiconductor structure and manufacturing method thereof Grant 9,975,754 - Huang , et al. May 22, 2 | 2018-05-22 |
| Semiconductor Structure And Manufacturing Method Thereof App 20180111824 - WU; TZU-HENG ; et al. | 2018-04-26 |
| MEMS structure and method of forming same Grant 9,859,819 - Tsai , et al. January 2, 2 | 2018-01-02 |
| Semiconductor Structure And Method For Fabricating The Same App 20170341933 - SHEN; WEI-CHENG ; et al. | 2017-11-30 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170297901 - HUANG; FU-CHUN ; et al. | 2017-10-19 |
| Semiconductor structure and manufacturing method thereof Grant 9,656,855 - Huang , et al. May 23, 2 | 2017-05-23 |
| Semiconductor bonding structure and process Grant 9,502,370 - Chang , et al. November 22, 2 | 2016-11-22 |
| Capacitor with planarized bonding for CMOS-MEMS integration Grant 9,493,346 - Shen , et al. November 15, 2 | 2016-11-15 |
| VHF etch barrier for semiconductor integrated microsystem Grant 9,449,867 - Wu , et al. September 20, 2 | 2016-09-20 |
| Isolation structure for MEMS 3D IC integration Grant 9,446,945 - Tsai , et al. September 20, 2 | 2016-09-20 |
| Support structure for TSV in MEMS structure Grant 9,422,153 - Tsai , et al. August 23, 2 | 2016-08-23 |
| Cavity structure using patterned sacrificial layer Grant 9,418,849 - Chang , et al. August 16, 2 | 2016-08-16 |
| Semiconductor Bonding Structure and Process App 20160163670 - Chang; Kuei-Sung ; et al. | 2016-06-09 |
| Isolation Structure For Mems 3d Ic Integration App 20160145095 - Tsai; Yi-Heng ; et al. | 2016-05-26 |
| Semiconductor bonding structure and process Grant 9,281,287 - Chang , et al. March 8, 2 | 2016-03-08 |
| Method for handling a thin substrate and for substrate capping Grant 9,266,724 - Chang , et al. February 23, 2 | 2016-02-23 |
| Capacitor With Planarized Bonding For Cmos-mems Integration App 20160031704 - Shen; Wei-Cheng ; et al. | 2016-02-04 |
| Vhf Etch Barrier For Semiconductor Integrated Microsystem App 20150364363 - Wu; Tzu-Heng ; et al. | 2015-12-17 |
| Support Structure for TSV in MEMS Structure App 20150321902 - Tsai; Yi Heng ; et al. | 2015-11-12 |
| MEMS Structure and Method of Forming Same App 20150288297 - Tsai; Yi Heng ; et al. | 2015-10-08 |
| Support structure for TSV in MEMS structure Grant 9,085,456 - Tsai , et al. July 21, 2 | 2015-07-21 |
| MEMS structure and method of forming same Grant 9,065,358 - Tsai , et al. June 23, 2 | 2015-06-23 |
| Semiconductor Bonding Structure and Process App 20150054161 - Chang; Kuei-Sung ; et al. | 2015-02-26 |
| Cavity Structure Using Patterned Sacrificial Layer App 20140361412 - Chang; Kuei-Sung ; et al. | 2014-12-11 |
| Electrical bypass structure for MEMS device Grant 8,878,312 - Hung , et al. November 4, 2 | 2014-11-04 |
| Semiconductor bonding structure and process Grant 8,878,355 - Chang , et al. November 4, 2 | 2014-11-04 |
| Method for Handling a Thin Substrate and for Substrate Capping App 20140322894 - Chang; Kuei-Sung ; et al. | 2014-10-30 |
| Method for handling a thin substrate and for substrate capping Grant 8,796,110 - Chang , et al. August 5, 2 | 2014-08-05 |
| Semiconductor Bonding Structure and Process App 20140117510 - Chang; Kuei-Sung ; et al. | 2014-05-01 |
| Microstructure device with an improved anchor Grant 8,704,317 - Lin , et al. April 22, 2 | 2014-04-22 |
| MEMS device etch stop Grant 8,633,554 - Chu , et al. January 21, 2 | 2014-01-21 |
| Support Structure for TSV in MEMS Structure App 20130181355 - Tsai; Yi Heng ; et al. | 2013-07-18 |
| Mems Device Etch Stop App 20130140653 - Chu; Chia-Hua ; et al. | 2013-06-06 |
| Microstructure Device with an Improved Anchor App 20130126989 - Lin; Chung-Hsien ; et al. | 2013-05-23 |
| Method for Handling a Thin Substrate and for Substrate Capping App 20130052797 - Chang; Kuei-Sung ; et al. | 2013-02-28 |
| MEMS device etch stop Grant 8,368,152 - Chu , et al. February 5, 2 | 2013-02-05 |
| MEMS Structure And Method Of Forming Same App 20130015743 - Tsai; Yi Heng ; et al. | 2013-01-17 |
| Microstructure device with an improved anchor Grant 8,343,789 - Lin , et al. January 1, 2 | 2013-01-01 |
| Mems Device Etch Stop App 20120261830 - Chu; Chia-Hua ; et al. | 2012-10-18 |
| Electrical Bypass Structure For Mems Device App 20120223613 - Hung; Chia-Ming ; et al. | 2012-09-06 |
| Package systems having a conductive element through a substrate thereof and manufacturing methods of the same Grant 8,232,614 - Chu , et al. July 31, 2 | 2012-07-31 |
| Microstructure Device With An Improved Anchor App 20120043626 - Lin; Chung-Hsien ; et al. | 2012-02-23 |
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