Tsai; Yi-Da
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Yi-Da.The latest application filed is for "semiconductor package structure".
- Tsai; Yi-Da - Chiayi Country TW
- TSAI; YI-DA - CHIAYI COUNTY TW
- TSAI; Yi-Da - Dongshi Township TW
- Tsai; Yi-Da - Taoyuan TW
- Tsai; Yi-Da - Donshi Township TW
- TSAI; Yi-Da - Taoyuan City TW
| Patent | Date |
|---|---|
| Semiconductor package and method of forming the same Grant 11,075,131 - Tsai , et al. July 27, 2 | 2021-07-27 |
| Semiconductor Package Structure App 20210217728 - HUNG; JENG-NAN ; et al. | 2021-07-15 |
| Semiconductor package structure Grant 10,971,475 - Hung , et al. April 6, 2 | 2021-04-06 |
| Package Structure And Method For Manufacturing The Same App 20210098384 - TSAI; Yi-Da ; et al. | 2021-04-01 |
| Semiconductor Package And Method Of Forming The Same App 20210057298 - Tsai; Yi-Da ; et al. | 2021-02-25 |
| Advanced INFO POP and Method of Forming Thereof App 20210020611 - Tsai; Yi-Da ; et al. | 2021-01-21 |
| Scanning imaging device and animal carrying bed thereof Grant 10,874,368 - Tsai , et al. December 29, 2 | 2020-12-29 |
| Method for manufacturing package structure Grant 10,867,932 - Tsai , et al. December 15, 2 | 2020-12-15 |
| Advanced INFO POP and method of forming thereof Grant 10,797,025 - Tsai , et al. October 6, 2 | 2020-10-06 |
| Method For Manufacturing Package Structure App 20200152576 - TSAI; Yi-Da ; et al. | 2020-05-14 |
| Package And Method Of Manufacturing The Same App 20200020634 - Tsai; Tsai-Tsung ; et al. | 2020-01-16 |
| Package structure and method for forming the same Grant 10,535,609 - Tsai , et al. Ja | 2020-01-14 |
| Semiconductor Package Structure App 20190363066 - HUNG; JENG-NAN ; et al. | 2019-11-28 |
| Semiconductor package structure and method of manufacturing the same Grant 10,373,931 - Hung , et al. | 2019-08-06 |
| Package Structure And Method For Forming The Same App 20180308800 - TSAI; Yi-Da ; et al. | 2018-10-25 |
| Scanning Imaging Device And Animal Carrying Bed Thereof App 20180214108 - TSAI; Yi-Da ; et al. | 2018-08-02 |
| Package structure and method for forming the same Grant 10,014,260 - Tsai , et al. July 3, 2 | 2018-07-03 |
| Scanning Imaging Device, Carrier And Carrier Positioning Device App 20180177471 - HSU; Chih-Yuan ; et al. | 2018-06-28 |
| Semiconductor Package Structure And Method Of Manufacturing The Same App 20180151538 - HUNG; JENG-NAN ; et al. | 2018-05-31 |
| Package Structure And Method For Forming The Same App 20180130749 - TSAI; Yi-Da ; et al. | 2018-05-10 |
| Imaging scanner Grant D804,031 - Hsu , et al. November 28, 2 | 2017-11-28 |
| Advanced INFO POP and Method of Forming Thereof App 20170338202 - Tsai; Yi-Da ; et al. | 2017-11-23 |
| Semiconductor packages Grant 9,312,243 - Chen , et al. April 12, 2 | 2016-04-12 |
| Semiconductor Packages App 20150008594 - Chen; Meng-Tse ; et al. | 2015-01-08 |
| Methods and apparatus for package on package structures Grant 8,889,486 - Chen , et al. November 18, 2 | 2014-11-18 |
| Methods and Apparatus for Package on Package Structures App 20140061932 - Chen; Meng-Tse ; et al. | 2014-03-06 |
| Fine Pitch Package-on-Package Structure App 20140042622 - Tsai; Tsai-Tsung ; et al. | 2014-02-13 |
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