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Tsai; Yao-Jun Patent Filings

Tsai; Yao-Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Yao-Jun.The latest application filed is for "subpixel structure, pixel structure, and light emitting diode chip for the same".

Company Profile
4.23.26
  • Tsai; Yao-Jun - Taoyuan TW
  • Tsai; Yao-Jun - Taoyuan City TW
  • Tsai; Yao-Jun - Taoyuan County TW
  • Tsai; Yao-Jun - Zhongli N/A TW
  • TSAI; Yao-Jun - Zhongli City TW
  • Tsai; Yao-Jun - Jhongli TW
  • Tsai; Yao-Jun - Jhongli City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Pixel structure having repairing light emitting diode die and extending conductor, manufacturing method of pixel structure, and display having pixel structure
Grant 11,443,692 - Wu , et al. September 13, 2
2022-09-13
Transfer support and transfer module
Grant 11,227,787 - Wu , et al. January 18, 2
2022-01-18
Subpixel Structure, Pixel Structure, And Light Emitting Diode Chip For The Same
App 20210280747 - Wu; Ming-Hsien ;   et al.
2021-09-09
Pixel Structure
App 20210193891 - Wu; Ming-Hsien ;   et al.
2021-06-24
Pixel Structure And Manufacturing Method Thereof, And Display Having The Same
App 20210183309 - Wu; Ming-Hsien ;   et al.
2021-06-17
Light-emitting Device And Display Apparatus
App 20210091265 - Guo; Yih-Der ;   et al.
2021-03-25
Light-emitting Device And Display Apparatus
App 20210057611 - Guo; Yih-Der ;   et al.
2021-02-25
Transfer support and transfer module
Grant 10,431,483 - Wu , et al. O
2019-10-01
Transfer Support And Transfer Module
App 20190019702 - Wu; Ming-Hsien ;   et al.
2019-01-17
Transfer Support And Transfer Module
App 20190019718 - Wu; Ming-Hsien ;   et al.
2019-01-17
Display pixel with redundant element and display panel
Grant 9,847,047 - Wu , et al. December 19, 2
2017-12-19
Display Pixel And Display Panel
App 20170162091 - Wu; Ming-Hsien ;   et al.
2017-06-08
Semiconductor laser structure
Grant 9,653,382 - Lin , et al. May 16, 2
2017-05-16
Light emitting diode
Grant 9,548,424 - Hsieh , et al. January 17, 2
2017-01-17
Light emitting diode
Grant 9,425,359 - Tsai , et al. August 23, 2
2016-08-23
Light emitting diode
Grant 9,391,239 - Tsai , et al. July 12, 2
2016-07-12
Substrate, method of fabricating the same, and application the same
Grant 9,252,079 - Tsai , et al. February 2, 2
2016-02-02
Semiconductor Laser Structure
App 20160020578 - Lin; Jui-Ying ;   et al.
2016-01-21
Wafer-level light emitting diode structure, light emitting diode chip, and method for forming the same
Grant 9,178,107 - Tsai , et al. November 3, 2
2015-11-03
Semiconductor laser structure
Grant 9,171,779 - Lin , et al. October 27, 2
2015-10-27
Light Emitting Diode
App 20150108526 - Tsai; Yao-Jun ;   et al.
2015-04-23
Light Emitting Diode
App 20150108527 - Hsieh; Chia-Fen ;   et al.
2015-04-23
Substrate, Method Of Fabricating The Same, And Application The Same
App 20150061084 - Tsai; Yao-Jun ;   et al.
2015-03-05
Semiconductor Laser Structure
App 20150063386 - Lin; Jui-Ying ;   et al.
2015-03-05
Light Emitting Diode
App 20140231851 - Tsai; Yao-Jun ;   et al.
2014-08-21
Light emitting diode chip, light emitting diode package structure, and method for forming the same
Grant 8,759,865 - Tsai , et al. June 24, 2
2014-06-24
Light emitting diode package structure
Grant 8,692,274 - Li , et al. April 8, 2
2014-04-08
Light Emitting Diode Chip, Light Emitting Diode Package Structure, And Method For Forming The Same
App 20130146936 - TSAI; Yao-Jun ;   et al.
2013-06-13
Light Emitting Diode Chip, Light Emitting Diode Package Structure, And Method For Forming The Same
App 20130087823 - Tsai; Yao-Jun ;   et al.
2013-04-11
Method for fabricating a light emitting diode package structure
Grant 8,349,627 - Tsai , et al. January 8, 2
2013-01-08
Light Emitting Diode Package Structure
App 20120199862 - Li; Chao-Wei ;   et al.
2012-08-09
Light emitting diode structure having a conductive thin film for connecting a light emitting stack to an electrode and LED packaging structure using the same
Grant 8,193,541 - Tsai , et al. June 5, 2
2012-06-05
Light emitting diode package structure
Grant 8,178,890 - Li , et al. May 15, 2
2012-05-15
Light emitting diode, package structure and manufacturing method thereof
Grant 8,138,518 - Tsai , et al. March 20, 2
2012-03-20
Light emitting diode package structure and method for fabricating the same
Grant 8,115,218 - Tsai , et al. February 14, 2
2012-02-14
Wafer-level Light Emitting Diode Structure, Light Emitting Diode Chip, And Method For Forming The Same
App 20120034714 - TSAI; Yao-Jun ;   et al.
2012-02-09
Light Emitting Diode Structure, LED Packaging Structure Using the Same and Method of Forming the Same
App 20110133229 - Tsai; Yao-Jun ;   et al.
2011-06-09
Method For Fabricating A Light Emitting Diode Package Structure
App 20110092002 - Tsai; Yao-Jun ;   et al.
2011-04-21
Light emitting diode package structure and method for fabricating the same
Grant 7,923,746 - Tsai , et al. April 12, 2
2011-04-12
Light emitting diode structure, LED packaging structure using the same and method of forming the same
Grant 7,883,910 - Tsai , et al. February 8, 2
2011-02-08
Light Emitting Diode Package Structure
App 20100213479 - Li; Chao-Wei ;   et al.
2010-08-26
Light Emitting Diode Structure, Led Packaging Structure Using The Same And Method Of Forming The Same
App 20100193809 - Tsai; Yao-Jun ;   et al.
2010-08-05
Light Emitting Diode, Package Structure And Manufacturing Method Thereof
App 20100072487 - Tsai; Yao-Jun ;   et al.
2010-03-25
Light Emitting Diode Package Structure And Method For Fabricating The Same
App 20090267102 - Tsai; Yao-Jun ;   et al.
2009-10-29
Light Emitting Diode Package Structure And Method For Fabricating The Same
App 20090230417 - Tsai; Yao-Jun ;   et al.
2009-09-17

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