Tsai; Ya Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Ya Wen.The latest application filed is for "chip packaging device and alignment bonding method thereof".
- Tsai; Ya Wen - Tainan TW
- Tsai; Ya-Wen - Tainan City TW
- Tsai; Ya-Wen - Kaohsiung N/A TW
- TSAI; YA-WEN - KAOHSIUNG CITY TW
| Patent | Date |
|---|---|
| Sample chip for electron microscope and its related application Grant 10,978,269 - Hsieh , et al. April 13, 2 | 2021-04-13 |
| Chip packaging device and alignment bonding method thereof Grant 10,685,852 - Hsieh , et al. | 2020-06-16 |
| Chip Packaging Device And Alignment Bonding Method Thereof App 20200144078 - Hsieh; Po-Tsung ; et al. | 2020-05-07 |
| Sample Chip For Electron Microscope And Its Related Application App 20190272972 - Hsieh; Po Tsung ; et al. | 2019-09-05 |
| Lycogen extract, composition thereof and method for the treatment using the same Grant 8,563,267 - Liu , et al. October 22, 2 | 2013-10-22 |
| Lycogen Extract, Composition Thereof And Method For The Treatment Using The Same App 20120027707 - LIU; WEN-SHENG ; et al. | 2012-02-02 |
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