Tsai; Wen-Ta
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Wen-Ta.The latest application filed is for "semiconductor package with enhanced chip groundability and method of fabricating the same".
- Tsai; Wen-Ta - Hangzhou Zhejiang CN
- Tsai; Wen-Ta - Taichung TW
- Tsai; Wen-Ta - Taichung Hsien TW
- Tsai; Wen-Ta - Hangzhou Zhejiag CN
| Patent | Date |
|---|---|
| Chair Grant D569,116 - Tsai May 20, 2 | 2008-05-20 |
| Chair Grant D554,877 - Tsai November 13, 2 | 2007-11-13 |
| Armrest Grant D538,075 - Tsai March 13, 2 | 2007-03-13 |
| Armrest Grant D537,282 - Tsai February 27, 2 | 2007-02-27 |
| Armrest Grant D537,283 - Tsai February 27, 2 | 2007-02-27 |
| Chair Grant D516,828 - Tsai March 14, 2 | 2006-03-14 |
| Chair Grant D514,831 - Tsai February 14, 2 | 2006-02-14 |
| Chair Grant D514,832 - Tsai February 14, 2 | 2006-02-14 |
| Chair Grant D512,574 - Tsai December 13, 2 | 2005-12-13 |
| Semiconductor package with enhanced chip groundability and method of fabricating the same Grant 6,903,441 - Wang , et al. June 7, 2 | 2005-06-07 |
| Chair Grant D500,607 - Tsai January 11, 2 | 2005-01-11 |
| Dual-chip integrated circuit package and method of manufacturing the same Grant 6,777,266 - Huang , et al. August 17, 2 | 2004-08-17 |
| Semiconductor package with enhanced chip groundability and method of fabricating the same App 20040070087 - Wang, C. F. ; et al. | 2004-04-15 |
| Dual-chip integrated circuit package and method of manufacturing the same App 20030197262 - Huang, Chieh-Ping ; et al. | 2003-10-23 |
| Delamination-preventing substrate and semiconductor package with the same Grant 6,608,388 - Lin , et al. August 19, 2 | 2003-08-19 |
| Dual-chip integrated circuit package and method of manufacturing the same Grant 6,590,279 - Huang , et al. July 8, 2 | 2003-07-08 |
| Chair Grant D476,495 - Tsai July 1, 2 | 2003-07-01 |
| Chair Grant D475,210 - Tsai June 3, 2 | 2003-06-03 |
| Delamination-preventing substrate and semiconductor package with the same App 20030080439 - Lin, Yuan-Fu ; et al. | 2003-05-01 |
| Chair Grant D470,322 - Tsai February 18, 2 | 2003-02-18 |
| Chair armrest Grant D468,140 - Tsai January 7, 2 | 2003-01-07 |
| Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads Grant 6,307,257 - Huang , et al. October 23, 2 | 2001-10-23 |
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