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name:-0.014017105102539
name:-0.013141870498657
name:-0.00095915794372559
Tsai; Tzyy-Chyi Patent Filings

Tsai; Tzyy-Chyi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Tzyy-Chyi.The latest application filed is for "unloading mechanism".

Company Profile
0.15.11
  • Tsai; Tzyy-Chyi - New Taipei TW
  • Tsai; Tzyy-Chyi - Tu-Cheng TW
  • Tsai; Tzyy-Chyi - Taipei Hsien TW
  • Tsai; Tzyy-Chyi - Fullerton CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Unloading mechanism
Grant 9,761,469 - Yuan , et al. September 12, 2
2017-09-12
Unloading Mechanism
App 20150174764 - YUAN; LI-CAI ;   et al.
2015-06-25
Vacuum device and bonding apparatus using the same
Grant 8,851,134 - Lin , et al. October 7, 2
2014-10-07
Positioning device
Grant 8,720,878 - Lin , et al. May 13, 2
2014-05-13
Measurement apparatus and method thereof
Grant 8,561,806 - Lin , et al. October 22, 2
2013-10-22
Bonding apparatus
Grant 8,296,934 - Lin , et al. October 30, 2
2012-10-30
Bonding apparatus
Grant 8,291,956 - Lin , et al. October 23, 2
2012-10-23
Bonding method
Grant 8,256,108 - Lin , et al. September 4, 2
2012-09-04
Bonding Method
App 20120175041 - LIN; DONG-SHENG ;   et al.
2012-07-12
Sorting device
Grant 8,100,267 - Lin , et al. January 24, 2
2012-01-24
Positioning Device
App 20110285068 - LIN; DONG-SHENG ;   et al.
2011-11-24
Vacuum laminator
Grant 7,980,284 - Lin , et al. July 19, 2
2011-07-19
Vacuum Device And Bonding Apparatus Using The Same
App 20110021105 - LIN; Dong-Sheng ;   et al.
2011-01-27
Bonding Apparatus
App 20110017405 - LIN; Dong-Sheng ;   et al.
2011-01-27
Hot-melting method with simultaneous heating and cooling of workpieces
Grant 7,847,217 - Chen , et al. December 7, 2
2010-12-07
Measurement Apparatus And Method Thereof
App 20100260583 - LIN; Dong-Sheng ;   et al.
2010-10-14
Sorting Device
App 20100256806 - LIN; DONG-SHENG ;   et al.
2010-10-07
Vacuum Laminator
App 20100243171 - LIN; DONG-SHENG ;   et al.
2010-09-30
Bonding Apparatus And Method
App 20100236058 - LIN; DONG-SHENG ;   et al.
2010-09-23
Hot-melting machine with rotatable worktable
Grant 7,745,761 - Chen , et al. June 29, 2
2010-06-29
Hot-melting method with simultaneous heating and cooling of workpieces
App 20080053616 - Chen; Shun-Ho ;   et al.
2008-03-06
Hot-melting machine with rotatable worktable
App 20080023148 - Chen; Shun-Ho ;   et al.
2008-01-31
Cooling mold with gas grooves
Grant 7,290,591 - Chen , et al. November 6, 2
2007-11-06

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