loadpatents
name:-0.053427219390869
name:-0.039822816848755
name:-0.0091688632965088
TSAI; Tsung-Yueh Patent Filings

TSAI; Tsung-Yueh

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSAI; Tsung-Yueh.The latest application filed is for "optical device package".

Company Profile
8.38.49
  • TSAI; Tsung-Yueh - Kaohsiung TW
  • Tsai; Tsung-Yueh - Kaohsiung City TW
  • Tsai; Tsung-Yueh - Kaohsiung County TW
  • Tsai; Tsung-Yueh - Gangshan Township TW
  • Tsai; Tsung-Yueh - Gangshan Jen TW
  • Tsai; Tsung-Yueh - Taichung TW
  • Tsai; Tsung-Yueh - T.E.P.E. TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Optical Device Package
App 20220238502 - TSAI; Tsung-Yueh ;   et al.		2022-07-28
Optical device package
Grant 11,302,682 - Tsai , et al. April 12, 2		2022-04-12
Optical Device And Method Of Manufacturing The Same
App 20220020885 - TSAI; Yu-Pin ;   et al.		2022-01-20
Optical device and method of manufacturing the same
Grant 11,133,423 - Tsai , et al. September 28, 2		2021-09-28
Semiconductor Package Device And Method Of Manufacturing The Same
App 20210296244 - CHANG; Chih-Hsin ;   et al.		2021-09-23
Semiconductor Device Package And Method For Manufacturing The Same
App 20210175205 - HUNG; Chih-Ming ;   et al.		2021-06-10
Semiconductor package device and method of manufacturing the same
Grant 11,024,570 - Chang , et al. June 1, 2		2021-06-01
Optical Device Package
App 20210125974 - TSAI; Tsung-Yueh ;   et al.		2021-04-29
Semiconductor device package and method for manufacturing the same
Grant 10,937,761 - Hung , et al. March 2, 2		2021-03-02
Optical Device And Method Of Manufacturing The Same
App 20210005761 - TSAI; Yu-Pin ;   et al.		2021-01-07
Semiconductor Package Device And Method Of Manufacturing The Same
App 20200303294 - CHANG; Chih-Hsin ;   et al.		2020-09-24
Semiconductor Device Package And Method For Manufacturing The Same
App 20200118968 - HUNG; Chih-Ming ;   et al.		2020-04-16
Semiconductor package device
Grant 10,545,581 - Ou , et al. Ja		2020-01-28
Semiconductor device package and method for manufacturing the same
Grant 10,522,505 - Hung , et al. Dec		2019-12-31
Semiconductor Package Device
App 20190107897 - OU; Jen-Kai ;   et al.		2019-04-11
Fan-out ball grid array package structure and process for manufacturing the same
Grant 10,242,940 - Yeh , et al.		2019-03-26
Optical device and method of manufacturing the same
Grant 10,147,835 - Chen , et al. De		2018-12-04
Semiconductor Device Package And Method For Manufacturing The Same
App 20180294247 - HUNG; Chih-Ming ;   et al.		2018-10-11
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180269347 - CHEN; Po-Nien ;   et al.		2018-09-20
Fan-out Ball Grid Array Package Structure And Process For Manufacturing The Same
App 20180108602 - YEH; Jung-Liang ;   et al.		2018-04-19
Light emitting package and LED bulb
Grant 9,618,191 - Chang , et al. April 11, 2		2017-04-11
Light Emitting Package And Led Bulb
App 20140254181 - Chang; Hsiao-Chuan ;   et al.		2014-09-11
Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof
Grant 8,592,982 - Lai , et al. November 26, 2		2013-11-26
Semiconductor package
Grant 8,421,242 - Chang , et al. April 16, 2		2013-04-16
Semiconductor package
Grant 8,368,216 - Lai , et al. February 5, 2		2013-02-05
Semiconductor device package having a buffer structure and method of fabricating the same
Grant 8,274,149 - Chang , et al. September 25, 2		2012-09-25
Apparatus and method for testing non-contact pads of a semiconductor device to be tested
Grant 8,253,431 - Lai , et al. August 28, 2		2012-08-28
Semiconductor device package
Grant 8,222,733 - Cheng , et al. July 17, 2		2012-07-17
Semiconductor device package having a jumper chip and method of fabricating the same
Grant 8,222,726 - Chang , et al. July 17, 2		2012-07-17
Semiconductor Package Having Proximity Communication Signal Input Terminals And Manufacturing Methods Thereof
App 20120153489 - LAI; YI-SHAO ;   et al.		2012-06-21
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof
App 20120119342 - Chang Chien; Pao-Huei ;   et al.		2012-05-17
Semiconductor Package And Method For Making The Same
App 20120091575 - Lai; Yi-Shao ;   et al.		2012-04-19
Semiconductor Package And Method For Making The Same
App 20120049360 - Lai; Yi-Shao ;   et al.		2012-03-01
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof
Grant 8,115,285 - Chen , et al. February 14, 2		2012-02-14
Wafer and semiconductor package
Grant 8,110,931 - Chang , et al. February 7, 2		2012-02-07
Semiconductor Package And Method For Making The Same
App 20110309516 - Lai; Yi-Shao ;   et al.		2011-12-22
Semiconductor package and method for packaging a semiconductor package
Grant 8,076,786 - Hung , et al. December 13, 2		2011-12-13
Semiconductor Package
App 20110298139 - Lai; Yi-Shao ;   et al.		2011-12-08
Semiconductor package and method for making the same
Grant 8,072,064 - Lai , et al. December 6, 2		2011-12-06
Apparatus and Method for Testing Non-Contact Pads of a Semiconductor Device to be Tested
App 20110291690 - Lai; Yi-Shao ;   et al.		2011-12-01
Semiconductor Package
App 20110278739 - Lai; Yi-Shao ;   et al.		2011-11-17
Semiconductor package and method for processing and bonding a wire
Grant 8,053,906 - Chang , et al. November 8, 2		2011-11-08
Semiconductor Device Package And Method Of Fabricating The Same
App 20110233764 - CHANG; Hsiao-Chuan ;   et al.		2011-09-29
Semiconductor Device Package And Method Of Fabricating The Same
App 20110233749 - CHANG; Hsiao-Chuan ;   et al.		2011-09-29
Semiconductor Device Package And Method Of Fabricating The Same
App 20110227212 - CHENG; Ming-Hsiang ;   et al.		2011-09-22
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package
Grant 8,018,075 - Chang , et al. September 13, 2		2011-09-13
Bonding strength measuring device
Grant 7,980,757 - Lai , et al. July 19, 2		2011-07-19
Semiconductor Package
App 20110156243 - CHANG; Hsiao-Chuan ;   et al.		2011-06-30
Test Kit For Testing A Chip Subassembly And A Testing Method By Using The Same
App 20110156739 - CHANG; Hsiao-Chuan ;   et al.		2011-06-30
Laser distance measuring apparatus and control method thereof
Grant 7,969,559 - Luo , et al. June 28, 2		2011-06-28
Tenon-and-mortise packaging structure
Grant 7,964,949 - Lai , et al. June 21, 2		2011-06-21
Chip structure and stacked chip package as well as method for manufacturing chip structures
Grant 7,955,897 - Tsai , et al. June 7, 2		2011-06-07
Semiconductor Package Structure Using The Same
App 20100200974 - Weng; Chao-Fu ;   et al.		2010-08-12
Laser distance-measuring apparatus and control methods thereof
Grant 7,773,203 - Tsai August 10, 2		2010-08-10
Laser Distance Measuring Apparatus And Control Method Thereof
App 20100157281 - Luo; Yin-Long ;   et al.		2010-06-24
Laser Distance-measuring Apparatus And Control Methods Thereof
App 20100123894 - Tsai; Tsung-Yueh		2010-05-20
Semiconductor Package And Method For Packaging A Semiconductor Package
App 20100007011 - HUNG; Chang Ying ;   et al.		2010-01-14
Wafer And Semiconductor Package
App 20100007004 - CHANG; Hsiao Chuan ;   et al.		2010-01-14
Semiconductor Package, Method For Enhancing The Bond Of A Bonding Wire, And Method For Manufacturing A Semiconductor Package
App 20100007010 - CHANG; Hsiao Chuan ;   et al.		2010-01-14
Semiconductor Package And Method For Processing And Bonding A Wire
App 20100007009 - CHANG; Hsiao Chuan ;   et al.		2010-01-14
Advanced Quad Flat No Lead Chip Package Having A Protective Layer To Enhance Surface Mounting And Manufacturing Methods Thereof
App 20090230526 - Chen; Chien-Wen ;   et al.		2009-09-17
Chip Structure And Stacked Chip Package As Well As Method For Manufacturing Chip Structures
App 20090230564 - TSAI; Tsung Yueh ;   et al.		2009-09-17
Bonding Strength Measuring Device
App 20090175312 - Lai; Yi-Shao ;   et al.		2009-07-09
Tenon-and-mortise packaging structure
App 20090096077 - Lai; Yi-Shao ;   et al.		2009-04-16
Package structure and manufacturing method thereof
App 20090051048 - Lai; Yi-Shao ;   et al.		2009-02-26
Package structure and manufacturing method thereof
App 20090051031 - Lai; Yi-Shao ;   et al.		2009-02-26
Stacked Chip Package
App 20070284756 - TSAI; Tsung Yueh ;   et al.		2007-12-13
Semiconductor package structure
App 20070222047 - Tsai; Tsung-Yueh ;   et al.		2007-09-27
Package structure compatible with cooling system
Grant 7,071,553 - Tsai , et al. July 4, 2		2006-07-04
Method for manufacturing a package
Grant 7,037,750 - Tsai , et al. May 2, 2		2006-05-02
Stacked chip-packaging structure
Grant 7,026,709 - Tsai , et al. April 11, 2		2006-04-11
Manufacturing method of ball grid array package
Grant 7,015,065 - Tsai , et al. March 21, 2		2006-03-21
Manufacturing method of ball grid array package
App 20050090043 - Tsai, Yu-Fang ;   et al.		2005-04-28
Fiber container and associated optical communication device
Grant 6,873,778 - Tsai , et al. March 29, 2		2005-03-29
Method of fabricating a wavelength division multiplexed (WDM) unit
Grant 6,854,900 - Lai , et al. February 15, 2		2005-02-15
Stacked Chip-packaging Structure
App 20050023657 - Tsai, Yu-Fang ;   et al.		2005-02-03
Package Structure Compatible With Cooling System
App 20050006756 - Tsai, Tsung-Yueh ;   et al.		2005-01-13
Package structure compatible with cooling system
Grant 6,801,429 - Tsai , et al. October 5, 2		2004-10-05
Reliable optical add/drop device
Grant 6,797,941 - Wang , et al. September 28, 2		2004-09-28
[package Structure Compatible With Cooling System]
App 20040165351 - TSAI, TSUNG-YUEH ;   et al.		2004-08-26
Method for manufacturing a package
App 20040161879 - Tsai, Yu-Fang ;   et al.		2004-08-19
Reliable optical add/drop device
App 20040026607 - Wang, Chin-Hsiang ;   et al.		2004-02-12
Fiber container and associated optical communication device
App 20030190134 - Tsai, Tsung-Yueh ;   et al.		2003-10-09
Method of fabricating a wavelength division multiplexed (WDM) unit
App 20030185507 - Lai, I-Jen ;   et al.		2003-10-02

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