Tsai; Tsai-Tsung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Tsai-Tsung.The latest application filed is for "semiconductor package system and method".

Company Profile

8.19.23

Tsai; Tsai-Tsung - Taoyuan City TW
Tsai; Tsai-Tsung - Taoyuan County TW
Tsai; Tsai-Tsung - Taoyuan TW
Tsai; Tsai Tsung - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package System and Method App 20210242150 - Huang; Hui-Min ; et al.	2021-08-05
Semiconductor package and method of forming the same Grant 11,075,131 - Tsai , et al. July 27, 2	2021-07-27
Semiconductor package, semiconductor device and method of forming the same Grant 11,056,474 - Yu , et al. July 6, 2	2021-07-06
Semiconductor package system and method Grant 10,985,122 - Huang , et al. April 20, 2	2021-04-20
Semiconductor Package And Method Of Forming The Same App 20210057298 - Tsai; Yi-Da ; et al.	2021-02-25
Semiconductor Package System and Method App 20200144206 - Huang; Hui-Min ; et al.	2020-05-07
Package And Method Of Manufacturing The Same App 20200020634 - Tsai; Tsai-Tsung ; et al.	2020-01-16
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same App 20200020677 - Chen; Meng-Tse ; et al.	2020-01-16
Semiconductor package system and method Grant 10,510,697 - Huang , et al. Dec	2019-12-17
Package on-package structure including a thermal isolation material and method of forming the same Grant 10,490,539 - Chen , et al. Nov	2019-11-26
Semiconductor Package, Semiconductor Device and Method of Forming the Same App 20190088635 - Yu; Chen-Hua ; et al.	2019-03-21
Methods for stud bump formation Grant 10,147,693 - Hwang , et al. De	2018-12-04
Semiconductor package, semiconductor device and method of forming the same Grant 10,134,717 - Yu , et al. November 20, 2	2018-11-20
Semiconductor Package System and Method App 20180331055 - Huang; Hui-Min ; et al.	2018-11-15
Semiconductor package system and method Grant 10,032,734 - Huang , et al. July 24, 2	2018-07-24
Semiconductor Package, Semiconductor Device and Method of Forming the Same App 20170092634 - YU; CHEN-HUA ; et al.	2017-03-30
Semiconductor Package System and Method App 20170005049 - Huang; Hui-Min ; et al.	2017-01-05
Semiconductor package, semiconductor device and method of forming the same Grant 9,530,762 - Yu , et al. December 27, 2	2016-12-27
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same App 20160343698 - Chen; Meng-Tse ; et al.	2016-11-24
Semiconductor package system and method Grant 9,449,908 - Huang , et al. September 20, 2	2016-09-20
Package-on-package structure including a thermal isolation material and method of forming the same Grant 9,418,971 - Chen , et al. August 16, 2	2016-08-16
Method of manufacturing a semiconductor device Grant 9,385,040 - Tsai , et al. July 5, 2	2016-07-05
Semiconductor Package System and Method App 20160035663 - Huang; Hui-Min ; et al.	2016-02-04
Methods for Stud Bump Formation and Apparatus for Performing the Same App 20150235975 - Hwang; Chien Ling ; et al.	2015-08-20
Method Of Manufacturing A Semiconductor Device App 20150235902 - TSAI; TSAI-TSUNG ; et al.	2015-08-20
Semiconductor Package, Semiconductor Device And Method Of Forming The Same App 20150200188 - YU; CHEN-HUA ; et al.	2015-07-16
Apparatus for stud bump formation Grant 9,021,682 - Hwang , et al. May 5, 2	2015-05-05
Fine-pitch package-on-package structures and methods for forming the same Grant 8,900,922 - Lin , et al. December 2, 2	2014-12-02
Warpage control in a package-on-package structure Grant 8,846,448 - Chen , et al. September 30, 2	2014-09-30
Package-on-package Structure Including A Thermal Isolation Material And Method Of Forming The Same App 20140124955 - CHEN; Meng-Tse ; et al.	2014-05-08
Warpage Control In A Package-on-package Structure App 20140045300 - Chen; Meng-Tse ; et al.	2014-02-13
Fine Pitch Package-on-Package Structure App 20140042622 - Tsai; Tsai-Tsung ; et al.	2014-02-13
Fine-Pitch Package-on-Package Structures and Methods for Forming the Same App 20130214431 - Lin; Cheng-Chung ; et al.	2013-08-22
Methods for Stud Bump Formation and Apparatus for Performing the Same App 20130167373 - Hwang; Chien Ling ; et al.	2013-07-04
Composition of dielectric material Grant 7,446,068 - Wang , et al. November 4, 2	2008-11-04

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