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Contact structures
Grant 11,257,718 - Park , et al. February 22, 2 | 2022-02-22 |
Contact Structures
App 20200176325 - PARK; Chanro ; et al. | 2020-06-04 |
Gate height control and ILD protection
Grant 10,629,699 - Greene , et al. | 2020-04-21 |
Contact structures
Grant 10,593,599 - Park , et al. | 2020-03-17 |
Contact Structures
App 20190279910 - PARK; Chanro ; et al. | 2019-09-12 |
Self-aligned contact with CMP stop layer
Grant 10,134,633 - Kamineni , et al. November 20, 2 | 2018-11-20 |
Semiconductor Structure With Gate Height Scaling
App 20180233580 - XIE; Ruilong ; et al. | 2018-08-16 |
Gate Height Control And Ild Protection
App 20180219081 - Greene; Andrew M. ; et al. | 2018-08-02 |
Gate height control and ILD protection
Grant 9,923,080 - Greene , et al. March 20, 2 | 2018-03-20 |
Structure and method for inhibiting cobalt diffusion
Grant 9,865,543 - Fang , et al. January 9, 2 | 2018-01-09 |
Methods of cutting gate structures on transistor devices
Grant 9,812,365 - Zhang , et al. November 7, 2 | 2017-11-07 |
Endpoint Determination Using Individually Measured Target Spectra
App 20160033958 - Tsai; Stan ; et al. | 2016-02-04 |
Method And Apparatus For Local Polishing Control
App 20110053465 - TSAI; STAN ; et al. | 2011-03-03 |
Method and apparatus for local polishing control
Grant 7,842,169 - Tsai , et al. November 30, 2 | 2010-11-30 |
Contacts for electrochemical processing
Grant 7,569,134 - Butterfield , et al. August 4, 2 | 2009-08-04 |
Pad for electrochemical processing
App 20090120803 - Butterfield; Paul ; et al. | 2009-05-14 |
Exchange Market Platform For Timeshare Properties
App 20090083137 - Tsai; Stan ; et al. | 2009-03-26 |
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
Grant 7,384,534 - Sun , et al. June 10, 2 | 2008-06-10 |
Contacts for electrochemical processing
Grant 7,303,662 - Mavliev , et al. December 4, 2 | 2007-12-04 |
Polishing solution retainer
Grant 7,232,363 - Zhang , et al. June 19, 2 | 2007-06-19 |
Contacts for electrochemical processing
Grant 7,125,477 - Butterfield , et al. October 24, 2 | 2006-10-24 |
Contacts For Electrochemical Processing
App 20060231414 - Butterfield; Paul ; et al. | 2006-10-19 |
Barrier removal at low polish pressure
Grant 7,104,869 - Tsai , et al. September 12, 2 | 2006-09-12 |
Tungsten electroprocessing
App 20060196778 - Jia; Renhe ; et al. | 2006-09-07 |
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
Grant 7,077,725 - Sun , et al. July 18, 2 | 2006-07-18 |
Pad for electrochemical processing
App 20060151336 - Butterfield; Paul ; et al. | 2006-07-13 |
Method and apparatus for local polishing control
App 20060124474 - Tsai; Stan ; et al. | 2006-06-15 |
Method and composition for the removal of residual materials during substrate planarization
Grant 7,022,608 - Sun , et al. April 4, 2 | 2006-04-04 |
Polishing solution retainer
App 20060019581 - Zhang; Hanzhong ; et al. | 2006-01-26 |
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
App 20050145507 - Sun, Lizhong ; et al. | 2005-07-07 |
Chemical mechanical polishing with shear force measurement
Grant 6,869,498 - Tsai , et al. March 22, 2 | 2005-03-22 |
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
Grant 6,863,797 - Sun , et al. March 8, 2 | 2005-03-08 |
Method and apparatus for forming metal layers
Grant 6,863,794 - Tsai , et al. March 8, 2 | 2005-03-08 |
Selective removal of tantalum-containing barrier layer during metal CMP
Grant 6,858,540 - Sun , et al. February 22, 2 | 2005-02-22 |
Method and apparatus for local polishing control
App 20040173461 - Tsai, Stan ; et al. | 2004-09-09 |
Method and apparatus for two-step barrier layer polishing
Grant 6,709,316 - Sun , et al. March 23, 2 | 2004-03-23 |
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
App 20040050817 - Sun, Lizhong ; et al. | 2004-03-18 |
Contacts for electrochemical processing
App 20040023495 - Butterfield, Paul ; et al. | 2004-02-05 |
Contacts for electrochemical processing
App 20040020788 - Mavliev, Rashid ; et al. | 2004-02-05 |
Pad cleaning for a CMP system
Grant 6,669,538 - Li , et al. December 30, 2 | 2003-12-30 |
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
App 20030116445 - Sun, Lizhong ; et al. | 2003-06-26 |
Method and apparatus for forming metal layers
App 20030057097 - Tsai, Stan ; et al. | 2003-03-27 |
Method and composition for the selective removal of residual materials and barrier materials during substrate planarization
Grant 6,524,167 - Tsai , et al. February 25, 2 | 2003-02-25 |
Selective removal of tantalum-containing barrier layer during metal CMP title
App 20030022801 - Sun, Lizhong ; et al. | 2003-01-30 |
Barrier removal at low polish pressure
App 20030013387 - Tsai, Stan ; et al. | 2003-01-16 |
Method and apparatus for two-step polishing
App 20020173221 - Li, Shijian ; et al. | 2002-11-21 |
Method and apparatus for electrochemical-mechanical planarization
App 20020111121 - Sun, Lizhong ; et al. | 2002-08-15 |
Pad Cleaning for a CMP system
App 20020090896 - Li, Shijian ; et al. | 2002-07-11 |
Method and composition for the removal of residual materials during substrate planarization
App 20020068454 - Sun, Lizhong ; et al. | 2002-06-06 |
Endpoint monitoring with polishing rate change
Grant 6,309,276 - Tsai , et al. October 30, 2 | 2001-10-30 |
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
Grant 6,299,741 - Sun , et al. October 9, 2 | 2001-10-09 |
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