Tsai; Shu-Ting
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Shu-Ting.The latest application filed is for "semiconductor devices and methods of manufacture thereof".
Company Profile
31.50.60
- Tsai; Shu-Ting - Kaohsiung TW
- Tsai; Shu-Ting - Kaohsiung City TW
- Tsai; Shu-Ting - Kaohsiun TW
- Tsai; Shu-Ting - Kaohsiun City TW
- Tsai; Shu-Ting - Kaoshiung TW
- Tsai; Shu-Ting - Kaoshiung City TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Devices And Methods Of Manufacture Thereof App 20220208749 - Tsai; Shu-Ting ; et al. | 2022-06-30 |
| BSI image sensor and method of forming same Grant 11,315,972 - Hsu , et al. April 26, 2 | 2022-04-26 |
| Backside Illuminated Global Shutter Image Sensor App 20210272989 - Lin; Jeng-Shyan ; et al. | 2021-09-02 |
| BSI Image Sensor and Method of Forming Same App 20210233945 - Hsu; Hung-Wen ; et al. | 2021-07-29 |
| Interconnect Structure for Stacked Device App 20210233813 - Tsai; Shu-Ting ; et al. | 2021-07-29 |
| Backside illuminated global shutter image sensor Grant 11,018,177 - Lin , et al. May 25, 2 | 2021-05-25 |
| Structure and method for 3D image sensor Grant 11,011,567 - Kao , et al. May 18, 2 | 2021-05-18 |
| Interconnect structure for stacked device Grant 10,978,345 - Tsai , et al. April 13, 2 | 2021-04-13 |
| BSI Image Sensor and Method of Forming Same App 20210066357 - Hsu; Hung-Wen ; et al. | 2021-03-04 |
| Interconnect structure for stacked device and method Grant 10,861,899 - Chuang , et al. December 8, 2 | 2020-12-08 |
| Backside Illuminated Global Shutter Image Sensor App 20200381465 - Lin; Jeng-Shyan ; et al. | 2020-12-03 |
| BSI image sensor and method of forming same Grant 10,847,560 - Hsu , et al. November 24, 2 | 2020-11-24 |
| 3DIC interconnect apparatus and method Grant 10,840,287 - Chou , et al. November 17, 2 | 2020-11-17 |
| Stacked image sensor having a barrier layer Grant 10,818,720 - Chen , et al. October 27, 2 | 2020-10-27 |
| Interconnect Structure and Method of Forming Same App 20200306552 - Tsai; Shu-Ting ; et al. | 2020-10-01 |
| Interconnect apparatus and method for a stacked semiconductor device Grant 10,763,292 - Lin , et al. Sep | 2020-09-01 |
| Interconnect structure and method of forming same Grant 10,682,523 - Tsai , et al. | 2020-06-16 |
| Interconnect Structure for Stacked Device and Method App 20200127027 - Chuang; Chun-Chieh ; et al. | 2020-04-23 |
| Structure and Method for 3D Image Sensor App 20200075659 - Kao; Min-Feng ; et al. | 2020-03-05 |
| Interconnect structure for stacked device and method Grant 10,535,706 - Chuang , et al. Ja | 2020-01-14 |
| Structure and method for 3D Image sensor Grant 10,535,697 - Kao , et al. Ja | 2020-01-14 |
| 3DIC interconnect apparatus and method Grant 10,510,729 - Tsai , et al. Dec | 2019-12-17 |
| 3DIC Interconnect Apparatus and Method App 20190363126 - Chou; Shih Pei ; et al. | 2019-11-28 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20190279974 - Tsai; Shu-Ting ; et al. | 2019-09-12 |
| Stacked Image Sensor Having A Barrier Layer App 20190259799 - Chen; U-Ting ; et al. | 2019-08-22 |
| BSI Image Sensor and Method of Forming Same App 20190252423 - Hsu; Hung-Wen ; et al. | 2019-08-15 |
| 3DIC interconnect apparatus and method Grant 10,361,234 - Chou , et al. | 2019-07-23 |
| Method of manufacturing semiconductor devices having conductive plugs with varying widths Grant 10,304,818 - Tsai , et al. | 2019-05-28 |
| Interconnect Apparatus and Method App 20190148435 - Lin; Jeng-Shyan ; et al. | 2019-05-16 |
| Stacked image sensor having a barrier layer Grant 10,283,547 - Chen , et al. | 2019-05-07 |
| Interconnect Structure for Stacked Device and Method App 20190131330 - Chuang; Chun-Chieh ; et al. | 2019-05-02 |
| BSI image sensor and method of forming same Grant 10,269,843 - Hsu , et al. | 2019-04-23 |
| 3DIC Interconnect Apparatus and Method App 20190115322 - Tsai; Shu-Ting ; et al. | 2019-04-18 |
| Interconnect Structure For Stacked Device App 20190051559 - Tsai; Shu-Ting ; et al. | 2019-02-14 |
| Interconnect Structure and Method of Forming Same App 20190046806 - Tsai; Shu-Ting ; et al. | 2019-02-14 |
| Interconnect apparatus and method Grant 10,163,956 - Lin , et al. Dec | 2018-12-25 |
| 3DIC Interconnect Apparatus and Method App 20180366447 - Tsai; Shu-Ting ; et al. | 2018-12-20 |
| 3DIC interconnect apparatus and method Grant 10,157,891 - Tsai , et al. Dec | 2018-12-18 |
| Interconnect structure for stacked device and method Grant 10,157,959 - Chuang , et al. Dec | 2018-12-18 |
| Interconnect structure and method of forming same Grant 10,092,768 - Tsai , et al. October 9, 2 | 2018-10-09 |
| Interconnect structure for stacked device Grant 10,096,515 - Tsai , et al. October 9, 2 | 2018-10-09 |
| 3DIC interconnect apparatus and method Grant 10,056,353 - Tsai , et al. August 21, 2 | 2018-08-21 |
| 3DIC Interconnect Apparatus and Method App 20180226449 - Chou; Shih Pei ; et al. | 2018-08-09 |
| BSI Image Sensor and Method of Forming Same App 20180197903 - Hsu; Hung-Wen ; et al. | 2018-07-12 |
| Interconnect Structure For Stacked Device And Method App 20180130836 - Chuang; Chun-Chieh ; et al. | 2018-05-10 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20180102351 - Tsai; Shu-Ting ; et al. | 2018-04-12 |
| 3DIC interconnect apparatus and method Grant 9,941,320 - Chou , et al. April 10, 2 | 2018-04-10 |
| Multi-wafer stacking by Ox-Ox bonding Grant 9,941,249 - Tsai , et al. April 10, 2 | 2018-04-10 |
| BSI image sensor and method of forming same Grant 9,917,121 - Hsu , et al. March 13, 2 | 2018-03-13 |
| Structure and Method for 3D Image Sensor App 20180061880 - Kao; Min-Feng ; et al. | 2018-03-01 |
| 3DIC Interconnect Apparatus and Method App 20180012870 - Tsai; Shu-Ting ; et al. | 2018-01-11 |
| Interconnect structure for stacked device and method Grant 9,865,645 - Chuang , et al. January 9, 2 | 2018-01-09 |
| Interconnect Structure and Method of Forming Same App 20180001099 - Tsai; Shu-Ting ; et al. | 2018-01-04 |
| Seal ring structure with a metal pad Grant 9,812,409 - Lin , et al. November 7, 2 | 2017-11-07 |
| Structure and method for 3D image sensor Grant 9,812,487 - Kao , et al. November 7, 2 | 2017-11-07 |
| BSI Image Sensor and Method of Forming Same App 20170278881 - Hsu; Hung-Wen ; et al. | 2017-09-28 |
| Interconnect structure and method of forming same Grant 9,764,153 - Tsai , et al. September 19, 2 | 2017-09-19 |
| 3DIC interconnect apparatus and method Grant 9,754,925 - Tsai , et al. September 5, 2 | 2017-09-05 |
| Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods Grant 9,748,304 - Chen , et al. August 29, 2 | 2017-08-29 |
| Stacked Image Sensor Having a Barrier Layer App 20170110497 - Chen; U-Ting ; et al. | 2017-04-20 |
| Interconnect Apparatus and Method App 20170110496 - Lin; Jeng-Shyan ; et al. | 2017-04-20 |
| Structure and Method for 3D Image Sensor App 20170098679 - Kao; Min-Feng ; et al. | 2017-04-06 |
| Interconnect structure for connecting dies and methods of forming the same Grant 9,553,020 - Tsai , et al. January 24, 2 | 2017-01-24 |
| 3DIC interconnect devices and methods of forming same Grant 9,543,257 - Tsai , et al. January 10, 2 | 2017-01-10 |
| Interconnect apparatus and method Grant 9,536,777 - Lin , et al. January 3, 2 | 2017-01-03 |
| Stacked image sensor having a barrier layer Grant 9,536,920 - Chen , et al. January 3, 2 | 2017-01-03 |
| Multi-Wafer Stacking by Ox-Ox Bonding App 20160379963 - Tsai; Shu-Ting ; et al. | 2016-12-29 |
| Structure and method for 3D image sensor Grant 9,525,003 - Kao , et al. December 20, 2 | 2016-12-20 |
| 3DIC Interconnect Apparatus and Method App 20160351546 - Tsai; Shu-Ting ; et al. | 2016-12-01 |
| Interconnect Structure For Connecting Dies And Methods Of Forming The Same App 20160336231 - Tsai; Shu-Ting ; et al. | 2016-11-17 |
| 3DIC interconnect devices and methods of forming same Grant 9,455,158 - Tsai , et al. September 27, 2 | 2016-09-27 |
| Interconnect Structure For Stacked Device And Method App 20160276383 - Chuang; Chun-Chieh ; et al. | 2016-09-22 |
| Interconnect structure for connecting dies and methods of forming the same Grant 9,406,712 - Tsai , et al. August 2, 2 | 2016-08-02 |
| 3DIC Interconnect Apparatus and Method App 20160204154 - Chou; Shih Pei ; et al. | 2016-07-14 |
| Interconnect structure for stacked device and method Grant 9,356,066 - Chuang , et al. May 31, 2 | 2016-05-31 |
| 3DIC interconnect apparatus and method Grant 9,293,392 - Chou , et al. March 22, 2 | 2016-03-22 |
| Imaging sensor structure and method Grant 9,287,312 - Kao , et al. March 15, 2 | 2016-03-15 |
| 3DIC Interconnect Devices and Methods of Forming Same App 20150348917 - Tsai; Shu-Ting ; et al. | 2015-12-03 |
| 3DIC Interconnect Devices and Methods of Forming Same App 20150348905 - Tsai; Shu-Ting ; et al. | 2015-12-03 |
| 3DIC Interconnect Devices and Methods of Forming Same App 20150348874 - Tsai; Shu-Ting ; et al. | 2015-12-03 |
| Interconnect Structure for Connecting Dies and Methods of Forming the Same App 20150287757 - Tsai; Shu-Ting ; et al. | 2015-10-08 |
| Structure and Method for 30 Image Sensor App 20150279893 - KAO; Min-Feng ; et al. | 2015-10-01 |
| Stacked Image Sensor Having a Barrier Layer App 20150279891 - Chen; U-Ting ; et al. | 2015-10-01 |
| Image sensor for mitigating dark current Grant 9,147,702 - Hung , et al. September 29, 2 | 2015-09-29 |
| Seal Ring Structure With A Metal Pad App 20150249057 - Lin; Jeng-Shyan ; et al. | 2015-09-03 |
| Interconnect structure for connecting dies and methods of forming the same Grant 9,076,715 - Tsai , et al. July 7, 2 | 2015-07-07 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20150187701 - Tsai; Shu-Ting ; et al. | 2015-07-02 |
| 3DIC Interconnect Apparatus and Method App 20150179613 - Tsai; Shu-Ting ; et al. | 2015-06-25 |
| 3DIC Interconnect Apparatus and Method App 20150179612 - Tsai; Shu-Ting ; et al. | 2015-06-25 |
| Image Sensor Devices, Methods of Manufacture Thereof, and Semiconductor Device Manufacturing Methods App 20150171132 - Chen; U-Ting ; et al. | 2015-06-18 |
| Structure and method for 3D image sensor Grant 9,059,061 - Kao , et al. June 16, 2 | 2015-06-16 |
| Interconnect structure and method Grant 9,041,206 - Tsai , et al. May 26, 2 | 2015-05-26 |
| Seal ring structure with a metal pad Grant 9,035,445 - Lin , et al. May 19, 2 | 2015-05-19 |
| 3DIC Interconnect Apparatus and Method App 20150069619 - Chou; Shih Pei ; et al. | 2015-03-12 |
| Interconnect Structure and Method of Forming Same App 20140264883 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
| Structure and Method for 3D Image Sensor App 20140264508 - Kao; Min-Feng ; et al. | 2014-09-18 |
| Imaging Sensor Structure and Method App 20140264683 - Kao; Min-Feng ; et al. | 2014-09-18 |
| Interconnect Apparatus and Method App 20140264947 - Lin; Jeng-Shyan ; et al. | 2014-09-18 |
| Interconnect Structure for Connecting Dies and Methods of Forming the Same App 20140264709 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
| Interconnect Structure for Stacked Device App 20140264929 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
| Interconnect Sructure for Stacked Device and Method App 20140264682 - Chuang; Chun-Chieh ; et al. | 2014-09-18 |
| Interconnect Structure and Method App 20140264862 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
| Image Sensor For Mitigating Dark Current App 20140231949 - Hung; Feng-Chi ; et al. | 2014-08-21 |
| Multiple seal ring structure Grant 8,461,021 - Yaung , et al. June 11, 2 | 2013-06-11 |
| Multiple Seal Ring Structure App 20130109153 - Yaung; Dun-Nian ; et al. | 2013-05-02 |
| Seal Ring Structure With A Metal Pad App 20130082346 - Lin; Jeng-Shyan ; et al. | 2013-04-04 |
| Multiple seal ring structure Grant 8,338,917 - Yaung , et al. December 25, 2 | 2012-12-25 |
| Seal ring structure with metal pad Grant 8,283,754 - Lin , et al. October 9, 2 | 2012-10-09 |
| Seal Ring Structure With Metal Pad App 20120038020 - Lin; Jeng-Shyan ; et al. | 2012-02-16 |
| Multiple Seal Ring Structure App 20120038028 - Yaung; Dun-Nian ; et al. | 2012-02-16 |
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