Tsai; Shiann-Tsong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Shiann-Tsong.The latest application filed is for "semiconductor package having improved thermal interface between semiconductor die and heat spreading structure".

Company Profile

18.28.32

Tsai; Shiann-Tsong - Hsin-Chu TW
Tsai; Shiann-Tsong - Hsinchu City TW
Tsai; Shiann-Tsong - Hsinchu TW
- Hsinchu City TW
Tsai; Shiann-Tsong - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20220285297 - Hsu; Chia-Hao ; et al.	2022-09-08
Semiconductor Package With Emi Shielding Structure App 20220262741 - Tsai; Shiann-Tsong	2022-08-18
Semiconductor package with EMI shielding structure Grant 11,355,450 - Tsai June 7, 2	2022-06-07
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Grant 11,302,657 - Hsu , et al. April 12, 2	2022-04-12
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20220102297 - Hsu; Chia-Hao ; et al.	2022-03-31
Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires Grant 11,257,780 - Tsai February 22, 2	2022-02-22
Semiconductor package and fabrication method thereof Grant 11,239,179 - Tsai , et al. February 1, 2	2022-02-01
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Grant 11,227,846 - Hsu , et al. January 18, 2	2022-01-18
Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding Grant 11,211,340 - Tsai , et al. December 28, 2	2021-12-28
Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance Grant 10,923,435 - Tsai , et al. February 16, 2	2021-02-16
Semiconductor Package With Emi Shielding Structure App 20210035919 - Tsai; Shiann-Tsong	2021-02-04
Semiconductor package with in-package compartmental shielding and fabrication method thereof Grant 10,896,880 - Tsai , et al. January 19, 2	2021-01-19
Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires Grant 10,847,488 - Tsai November 24, 2	2020-11-24
Semiconductor package with in-package compartmental shielding and fabrication method thereof Grant 10,847,480 - Tsai November 24, 2	2020-11-24
Semiconductor Package And Fabrication Method Thereof App 20200343196 - Tsai; Chung-Che ; et al.	2020-10-29
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20200243462 - Hsu; Chia-Hao ; et al.	2020-07-30
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20200243464 - Hsu; Chia-Hao ; et al.	2020-07-30
Semiconductor Package Having Multi-tier Bonding Wires And Components Directly Mounted On The Multi-tier Bonding Wires App 20200235069 - Tsai; Shiann-Tsong	2020-07-23
Semiconductor Package With In-package Compartmental Shielding And Improved Heat-dissipation Performance App 20200194382A1 -	2020-06-18
Semiconductor chip package with resilient conductive paste post and fabrication method thereof Grant 10,685,943 - Tsai , et al.	2020-06-16
Semiconductor Package With In-package Compartmental Shielding And Active Electro-magnetic Compatibility Shielding App 20200168561A1 -	2020-05-28
Semiconductor Package With In-package Compartmental Shielding And Fabrication Method Thereof App 20200168560A1 -	2020-05-28
Glue Dispensing Apparatus App 20200075364 - Tsai; Shiann-Tsong	2020-03-05
Method for fabricating a semiconductor package Grant 10,340,259 - Tsai	2019-07-02
Mutual-operable Photo-capturing System App 20190166301 - Tsai; Shiann-Tsong ; et al.	2019-05-30
Social-network Information Connection System App 20190166078 - Tsai; Shiann-Tsong ; et al.	2019-05-30
Semiconductor package assembly Grant 10,276,465 - Tsai	2019-04-30
Semiconductor package with coated bonding wires and fabrication method thereof Grant 10,037,936 - Tsai , et al. July 31, 2	2018-07-31
Semiconductor package Grant 10,008,441 - Tsai June 26, 2	2018-06-26
Semiconductor Package Having Multi-tier Bonding Wires And Components Directly Mounted On The Multi-tier Bonding Wires App 20180166414 - Tsai; Shiann-Tsong	2018-06-14
Semiconductor Package Assembly App 20180090408 - TSAI; Shiann-Tsong	2018-03-29
Method For Fabricating A Semiconductor Package App 20180076185 - Tsai; Shiann-Tsong	2018-03-15
Semiconductor Chip Package And Fabrication Method Thereof App 20180006002 - Tsai; Shiann-Tsong ; et al.	2018-01-04
Semiconductor package and fabrication method thereof Grant 9,842,831 - Tsai December 12, 2	2017-12-12
Semiconductor Package App 20170179017 - TSAI; Shiann-Tsong	2017-06-22
Semiconductor Package With Coated Bonding Wires And Fabrication Method Thereof App 20170125327 - Tsai; Shiann-Tsong ; et al.	2017-05-04
Semiconductor Package And Fabrication Method Thereof App 20160336303 - Tsai; Shiann-Tsong	2016-11-17
Three-dimensional Avatar Generating System, Device And Method Thereof App 20160240015 - Tsai; Shiann-Tsong ; et al.	2016-08-18
Cloud 3d Model Construction System And Construction Method Thereof App 20150105889 - Tsai; Shiann-Tsong	2015-04-16
Method Of Fabricating A Semiconductor Package Structure App 20120220081 - Tsai; Shiann-Tsong	2012-08-30
Semiconductor device and fabrication method thereof Grant 7,993,970 - Tsai August 9, 2	2011-08-09
Semiconductor device and method for fabricating the same Grant 7,951,644 - Tsai May 31, 2	2011-05-31
Multi-substrate region-based package and method for fabricating the same Grant 7,859,118 - Tsai December 28, 2	2010-12-28
Fabrication method of semiconductor device Grant 7,772,034 - Tsai August 10, 2	2010-08-10
Ball Implantation Method And System Applying The Method App 20100163605 - Tsai; Shiann-Tsong	2010-07-01
Semiconductor Device And Method For Fabricating The Same App 20100148361 - Tsai; Shiann-Tsong	2010-06-17
Semiconductor wafer with adhesive protection layer App 20100052161 - Tsai; Shiann-Tsong	2010-03-04
Semiconductor Device And Fabrication Method Thereof App 20090243096 - Tsai; Shiann-Tsong	2009-10-01
Fabrication method of semiconductor device App 20090111221 - Tsai; Shiann-Tsong	2009-04-30
Multi-substrate region-based package and method for fabricating the same App 20090045527 - Tsai; Shiann-Tsong	2009-02-19
Multi-chip semiconductor package and fabrication method thereof Grant 7,091,623 - Tsai , et al. August 15, 2	2006-08-15
Strengthened window-type semiconductor package Grant 6,879,030 - Tsai , et al. April 12, 2	2005-04-12
Multi-chip semiconductor package and fabrication method thereof App 20050064631 - Tsai, Shiann-Tsong ; et al.	2005-03-24
Multi-chip semiconductor package and fabrication method thereof Grant 6,825,064 - Tsai , et al. November 30, 2	2004-11-30
Multi-chip semiconductor package and fabrication method thereof App 20040061146 - Tsai, Shiann-Tsong ; et al.	2004-04-01
Strengthened window-type semiconductor package App 20040061209 - Tsai, Shiann-Tsong ; et al.	2004-04-01

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