Tsai; Ming-Shih

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Ming-Shih.The latest application filed is for "chemical mechanical planarization composition for polishing oxide materials and method of use thereof".

Company Profile

2.7.10

Tsai; Ming-Shih - Tempe AZ
Tsai; Ming-Shih - Hsinchu TW
Tsai; Ming-Shih - Hsin Chu TW
Tsai; Ming-Shih - Jhudong Township N/A TW
Tsai; Ming-Shih - Hsinchu County TW
Tsai, Ming-Shih - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications Grant 11,401,441 - Shi , et al. August 2, 2	2022-08-02
Chemical Mechanical Planarization Composition For Polishing Oxide Materials And Method Of Use Thereof App 20200048551 - Tsai; Ming-Shih ; et al.	2020-02-13
Chemical Mechanical Planarization (CMP) Composition and Methods Therefore for Copper and Through Silica Via (TSV) Applications App 20190055430 - Shi; Xiaobo ; et al.	2019-02-21
Cmp Compositions And Methods For Suppressing Polysilicon Removal Rates App 20140197356 - MOEGGENBORG; Kevin ; et al.	2014-07-17
CMP compositions and methods for suppressing polysilicon removal rates Grant 8,691,695 - Moeggenborg , et al. April 8, 2	2014-04-08
Compositions for CMP of semiconductor materials Grant 8,529,680 - De Rege Thesauro , et al. September 10, 2	2013-09-10
Cmp Compositions And Methods For Suppressing Polysilicon Removal Rates App 20120094489 - Moeggenborg; Kevin ; et al.	2012-04-19
Compositions For Cmp Of Semiconductor Materials App 20100314576 - THESAURO; Francesco DE REGE ; et al.	2010-12-16
Compositions and methods for CMP of semiconductor materials Grant 7,803,203 - De Rege Thesauro , et al. September 28, 2	2010-09-28
Compositions And Methods For Cmp Of Semiconductor Materials App 20070181535 - De Rege Thesauro; Francesco ; et al.	2007-08-09
Chemical mechanical polishing particles and slurry and method of producing the same App 20070144075 - Kin; Kon-Tsu ; et al.	2007-06-28
Composition for the chemical mechanical polishing of metal and metal/dielectric structures App 20030157804 - Puppe, Lothar ; et al.	2003-08-21
Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures App 20020106900 - Vogt, Kristina ; et al.	2002-08-08
Thin film transistor with sub-gates and schottky source/drain and a manufacturing method of the same App 20020009833 - Lin, Horng-Chih ; et al.	2002-01-24
Chemical mechanical polishing slurry for metallic thin film Grant 5,922,091 - Tsai , et al. July 13, 1	1999-07-13

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