Tsai; Min-Ying

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Min-Ying.The latest application filed is for "conductive contact for ion through-substrate via".

Company Profile

14.15.21

Tsai; Min-Ying - Kaohsiung City TW
Tsai; Min-Ying - Kaohsiung TW
Tsai; Min-Ying - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive Contact For Ion Through-substrate Via App 20220310691 - Tsai; Min-Ying ; et al.	2022-09-29
Conductive contact for ion through-substrate via Grant 11,398,516 - Tsai , et al. July 26, 2	2022-07-26
Deep Trench Isolations and Methods of Forming the Same App 20220130888 - Chou; Cheng-Hsien ; et al.	2022-04-28
Enhanced Trench Isolation Structure App 20220123031 - Tsai; Min-Ying ; et al.	2022-04-21
Semiconductor-on-insulator (SOI) substrate having dielectric structures that increase interface bonding strength Grant 11,232,975 - Tsai , et al. January 25, 2	2022-01-25
Deep trench isolations and methods of forming the same Grant 11,217,621 - Chou , et al. January 4, 2	2022-01-04
Image Sensor Device And Method Of Fabricating The Same App 20210375962 - LAI; CHIH-YU ; et al.	2021-12-02
Composite semiconductor substrate, semiconductor device and method for manufacturing the same Grant 11,171,039 - Tsai , et al. November 9, 2	2021-11-09
Back-side Deep Trench Isolation Structure For Image Sensor App 20210335861 - Cheng; Yu-Hung ; et al.	2021-10-28
Image sensor having stacked conformal films Grant 11,101,307 - Lai , et al. August 24, 2	2021-08-24
Image sensor having improved full well capacity and related method of formation Grant 11,069,733 - Cheng , et al. July 20, 2	2021-07-20
Semiconductor Structure And Manufacturing Method Thereof App 20210198752 - TSAI; Min-Ying ; et al.	2021-07-01
Image Sensor Having Improved Full Well Capacity And Related Method Of Formation App 20210183921 - Cheng; Yu-Hung ; et al.	2021-06-17
Image sensor having improved full well capacity and related method of formation Grant 10,971,534 - Cheng , et al. April 6, 2	2021-04-06
Conductive Contact For Ion Through-substrate Via App 20210066378 - Tsai; Min-Ying ; et al.	2021-03-04
Semiconductor structure and manufacturing method thereof Grant 10,930,547 - Tsai , et al. February 23, 2	2021-02-23
Semiconductor-on-insulator (SOI) substrate comprising a trap-rich layer with small grain sizes Grant 10,923,503 - Cheng , et al. February 16, 2	2021-02-16
Semiconductor structure and manufacturing method thereof Grant 10,867,834 - Tsai , et al. December 15, 2	2020-12-15
Image Sensor Having Improved Full Well Capacity And Related Method Of Formation App 20200212082 - Cheng; Yu-Hung ; et al.	2020-07-02
Image Sensor Having Improved Full Well Capacity And Related Method Of Formation App 20200212083 - Cheng; Yu-Hung ; et al.	2020-07-02
Image sensor having improved full well capacity and related method of formation Grant 10,658,410 - Cheng , et al.	2020-05-19
Semiconductor-on-insulator (soi) Substrate, Method For Forming Thereof, And Integrated Circuit App 20200098618 - Tsai; Min-Ying ; et al.	2020-03-26
Image Sensor Having Improved Full Well Capacity And Related Method Of Formation App 20200066768 - Cheng; Yu-Hung ; et al.	2020-02-27
Semiconductor-on-insulator (soi) Substrate Comprising A Trap-rich Layer With Small Grain Sizes App 20200006385 - Cheng; Yu-Hung ; et al.	2020-01-02
Composite Semiconductor Substrate, Semiconductor Device And Method For Manufacturing The Same App 20190304829 - TSAI; MIN-YING ; et al.	2019-10-03
Method for forming a thin semiconductor-on-insulator (SOI) substrate Grant 10,395,974 - Chou , et al. A	2019-08-27
Image Sensor Device And Method Of Fabricating The Same App 20190109162 - LAI; CHIH-YU ; et al.	2019-04-11
Method for forming deep trench structure Grant 10,163,647 - Tsai , et al. Dec	2018-12-25
Image device having multi-layered refractive layer on back surface Grant 10,163,949 - Lai , et al. Dec	2018-12-25
Semiconductor Structure And Manufacturing Method Thereof App 20180350660 - Tsai; Min-Ying ; et al.	2018-12-06
Method For Forming Deep Trench Structure App 20180166293 - TSAI; Min-Ying ; et al.	2018-06-14
Deep Trench Isolations and Methods of Forming the Same App 20170373117 - Chou; Cheng-Hsien ; et al.	2017-12-28
Image Device Having Multi=layered Refractive Layer On Back Surface App 20170271383 - LAI; CHIH-YU ; et al.	2017-09-21
Deep trench isolations and methods of forming the same Grant 9,754,993 - Chou , et al. September 5, 2	2017-09-05
Semiconductor Structure And Manufacturing Method Thereof App 20170194194 - TSAI; MIN-YING ; et al.	2017-07-06
Deep Trench Isolations and Methods of Forming the Same App 20170062512 - Chou; Cheng-Hsien ; et al.	2017-03-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.