TSAI; Meng-Shiun

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSAI; Meng-Shiun.The latest application filed is for "method for identifying friction parameter for linear module".

Company Profile

2.2.7

TSAI; Meng-Shiun - Chia-Yi County TW
Tsai; Meng-Shiun - Chia-Yi TW
Tsai; Meng-Shiun - Tainan TW
Tsai, Meng-Shiun - Tainan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Identifying Friction Parameter For Linear Module App 20170261529 - TSAI; Meng-Shiun ; et al.	2017-09-14
Method for detecting preload residual rate Grant 9,593,987 - Tsai , et al. March 14, 2	2017-03-14
Method For Detecting Preload Residual Rate App 20150377719 - TSAI; MENG-SHIUN ; et al.	2015-12-31
Method For Indentifying Friction Parameter For Linear Module App 20150377726 - TSAI; Meng-Shiun ; et al.	2015-12-31
Magnetic Coupler for Isolating Noise and Vibration Transmitted from a Drive Source on a Six-Axles CNC Hybrid Gearset Testing Machine App 20100206077 - Huang; San-Ming ; et al.	2010-08-19
Low-stress polishing device Grant 7,695,351 - Tsai , et al. April 13, 2	2010-04-13
Low-stress polishing device App 20080287045 - Tsai; Meng-Shiun ; et al.	2008-11-20
Method and device for measuring material properties App 20080156078 - Hsieh; Wen-Hsin ; et al.	2008-07-03
Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material App 20040259481 - Pan, Wen-Chueh ; et al.	2004-12-23

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