TSAI; JUNG-CHOU
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSAI; JUNG-CHOU.The latest application filed is for "interconnect structure, semiconductor structure including interconnect structure and method for forming the same".
- TSAI; JUNG-CHOU - HSINCHU TW
| Patent | Date |
|---|---|
| Interconnect Structure, Semiconductor Structure Including Interconnect Structure And Method For Forming The Same App 20210066223 - TSAI; JUNG-CHOU ; et al. | 2021-03-04 |
| Track-based Fill (tbf) Method For Metal Patterning App 20200104461 - HU; Wei-Yi ; et al. | 2020-04-02 |
| Method For Generating Layout Diagram Including Wiring Arrangement App 20190286784 - CHANG; Fong-Yuan ; et al. | 2019-09-19 |
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