Tsai; Jiunyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Jiunyu.The latest application filed is for "techniques for mram mtj top electrode connection".

Company Profile

15.10.16

Tsai; Jiunyu - Hsinchu City TW
Tsai; Jiunyu - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Techniques For Mram Mtj Top Electrode Connection App 20220246843 - Chuang; Harry-Hak-Lay ; et al.	2022-08-04
Techniques For Mram Mtj Top Electrode To Via Interface App 20220093684 - Chuang; Harry-Hak-Lay ; et al.	2022-03-24
Techniques for MRAM MTJ top electrode to via interface Grant 11,189,659 - Chuang , et al. November 30, 2	2021-11-30
Techniques For Mram Mtj Top Electrode Connection App 20210351345 - Chuang; Harry-Hak-Lay ; et al.	2021-11-11
Semiconductor Structure And Manufacturing Method Of The Same App 20210313394 - KALNITSKY; ALEXANDER ; et al.	2021-10-07
Techniques for MRAM MTJ top electrode connection Grant 11,075,335 - Chuang , et al. July 27, 2	2021-07-27
Semiconductor structure and manufacturing method of the same Grant 11,043,531 - Kalnitsky , et al. June 22, 2	2021-06-22
Techniques for MRAM MTJ top electrode to metal layer interface including spacer Grant 11,005,032 - Chuang , et al. May 11, 2	2021-05-11
Memory Cell With Top Electrode Via App 20210028350 - Ku; Ming-Che ; et al.	2021-01-28
Memory Cell With Top Electrode Via App 20200403146 - Ku; Ming-Che ; et al.	2020-12-24
Techniques for MRAM MTJ top electrode to metal layer interface including spacer Grant 10,797,230 - Chuang , et al. October 6, 2	2020-10-06
Memory cell with top electrode via Grant 10,790,439 - Ku , et al. September 29, 2	2020-09-29
Techniques For Mram Mtj Top Electrode To Metal Layer Interface Including Spacer App 20200119258 - Chuang; Harry-Hak-Lay ; et al.	2020-04-16
Techniques For Mram Mtj Top Electrode Connection App 20200098982 - Chuang; Harry-Hak-Lay ; et al.	2020-03-26
Semiconductor Structure And Manufacturing Method Of The Same App 20200091230 - KALNITSKY; ALEXANDER ; et al.	2020-03-19
Techniques For Mram Mtj Top Electrode To Via Interface App 20200075669 - Chuang; Harry-Hak-Lay ; et al.	2020-03-05
Memory Cell With Top Electrode Via App 20200035908 - Ku; Ming-Che ; et al.	2020-01-30
Techniques For Mram Mtj Top Electrode To Metal Layer Interface Including Spacer App 20200020848 - Chuang; Harry-Hak-Lay ; et al.	2020-01-16
Techniques for MRAM MTJ top electrode to metal layer interface including spacer Grant 10,522,740 - Chuang , et al. Dec	2019-12-31
Semiconductor structure and manufacturing method of the same Grant 10,504,958 - Kalnitsky , et al. Dec	2019-12-10
Techniques For Mram Mtj Top Electrode To Metal Layer Interface Including Spacer App 20190371996 - Chuang; Harry-Hak-Lay ; et al.	2019-12-05
Semiconductor Structure And Manufacturing Method Of The Same App 20190140018 - KALNITSKY; ALEXANDER ; et al.	2019-05-09
Method for manufacturing mixed-dimension and void-free MRAM structure Grant 10,109,790 - Chuang , et al. October 23, 2	2018-10-23
Method For Manufacturing Semiconductor Structure App 20170352804 - CHUANG; HARRY-HAK-LAY ; et al.	2017-12-07
Method For Manufacturing Mixed-dimension And Void-free Mram Structure App 20170301856 - CHUANG; HARRY-HAK-LAY ; et al.	2017-10-19
Method for manufacturing mixed-dimension and void-free MRAM structure Grant 9,780,301 - Chuang , et al. October 3, 2	2017-10-03

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