loadpatents
name:-0.011119842529297
name:-0.0080680847167969
name:-0.0036671161651611
TSAI; Jeng-Yu Patent Filings

TSAI; Jeng-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSAI; Jeng-Yu.The latest application filed is for "polymer and resin composition thereof".

Company Profile
2.8.10
  • TSAI; Jeng-Yu - Chiayi City TW
  • Tsai; Jeng-Yu - Chiayi TW
  • TSAI; Jeng-Yu - Chiayl City TW
  • Tsai; Jeng-Yu - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Compound, Resin Composition And Laminated Substrate Thereof
App 20220204442 - JENG; Jyh-Long ;   et al.
2022-06-30
Polymer And Resin Composition Thereof
App 20220204697 - JENG; Jyh-Long ;   et al.
2022-06-30
Composition, insulating material, and method for preparing an insulating material
Grant 11,118,082 - Jeng , et al. September 14, 2
2021-09-14
Composition, Insulating Material, And Method For Preparing An Insulating Material
App 20190203067 - JENG; Jyh-Long ;   et al.
2019-07-04
Low dielectric constant and solventless resin composition and substrate structure
Grant 10,316,182 - Jeng , et al.
2019-06-11
Adhesive Composition And Composite Substrate Employing The Same
App 20180179424 - JENG; Jyh-Long ;   et al.
2018-06-28
Low Dielectric Constant And Solventless Resin Composition And Substrate Structure
App 20170174880 - JENG; Jyh-Long ;   et al.
2017-06-22
Polymer, method for preparing the same, and a photosensitive resin composition thereof
Grant 9,477,148 - Jeng , et al. October 25, 2
2016-10-25
Polyimide copolymers and method for fabricating patterned metal oxide layers
Grant 9,169,357 - Jeng , et al. October 27, 2
2015-10-27
Thermally curable solder resist composition
Grant 8,420,745 - Jeng , et al. April 16, 2
2013-04-16
Polyimide Copolymers And Method For Fabricating Patterned Metal Oxide Layers
App 20130029049 - JENG; Jhy-Long ;   et al.
2013-01-31
Thermally Curable Solder Resist Composition
App 20110306703 - JENG; Jhy-Long ;   et al.
2011-12-15
Thermally Curable Solder Resist Composition
App 20100167205 - JENG; Jhy-Long ;   et al.
2010-07-01
Negative photoresist composition
Grant 7,374,861 - Jeng , et al. May 20, 2
2008-05-20
Negative photoresist composition
App 20070141509 - Jeng; Jyh-Long ;   et al.
2007-06-21

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