Tsai; Jeenhuei S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Jeenhuei S..The latest application filed is for "microelectronic assembly with underchip optical window, and method for forming same".

Company Profile

0.6.8

Tsai; Jeenhuei S. - Carmel IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods to provide and expose a diagnostic connector on overmolded electronic packages Grant 7,553,680 - Brandenburg , et al. June 30, 2	2009-06-30
Polymer encapsulated electrical devices Grant 7,352,070 - Ellis , et al. April 1, 2	2008-04-01
Technique for manufacturing an overmolded electronic assembly Grant 7,268,429 - Brandenburg , et al. September 11, 2	2007-09-11
Electronic module with form in-place pedestal Grant 7,202,571 - Thompson , et al. April 10, 2	2007-04-10
Microelectronic assembly with underchip optical window, and method for forming same App 20070007668 - Brandenburg; Scott D. ; et al.	2007-01-11
Technique for manufacturing an overmolded electronic assembly App 20060292751 - Brandenburg; Scott D. ; et al.	2006-12-28
Electronic module with form in-place pedestal App 20060033195 - Thompson; Brian D. ; et al.	2006-02-16
Methods to provide and expose a diagnostic connector on overmolded electronic packages App 20060027394 - Brandenburg; Scott D. ; et al.	2006-02-09
Microelectronic assembly with underchip optical window, and method for forming same App 20050224967 - Brandenburg, Scott D. ; et al.	2005-10-13
Method for forming an electronic assembly App 20050081377 - Brandenburg, Scott D. ; et al.	2005-04-21
Method for forming an electronic assembly Grant 6,807,731 - Brandenburg , et al. October 26, 2	2004-10-26
Overmolded circuit board with underfilled surface-mount component and method therefor Grant 6,693,239 - Myers , et al. February 17, 2	2004-02-17
Electromagnetic interference shield for overmolded packaging of an electronic assembly App 20030184976 - Brandenburg, Scott D. ; et al.	2003-10-02
Overmolded circuit board with underfilled surface-mount component and method therefor App 20030042035 - Myers, Bruce A. ; et al.	2003-03-06

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