| Patent | Date |
|---|
Semiconductor Structures And Method Of Manufacturing The Same
App 20220310542 - Yu; Chen-Hua ; et al. | 2022-09-29 |
Method For Removing Resistor Layer, And Method Of Manufacturing Semiconductor
App 20220299880 - Kuo; Hung-Jui ; et al. | 2022-09-22 |
Method of fabricating package structure
Grant 11,450,641 - Kuo , et al. September 20, 2 | 2022-09-20 |
Dense redistribution layers in semiconductor packages and methods of forming the same
Grant 11,417,604 - Yu , et al. August 16, 2 | 2022-08-16 |
Semiconductor package and method
Grant 11,404,308 - Kuo , et al. August 2, 2 | 2022-08-02 |
Alignment Holder And Testing Apparatus
App 20220238364 - Wang; Chih ; et al. | 2022-07-28 |
Method for removing resist layer, and method of manufacturing semiconductor
Grant 11,378,886 - Kuo , et al. July 5, 2 | 2022-07-05 |
Package Structure And Method Of Fabricating The Same
App 20220173033 - Kuo; Hung-Jui ; et al. | 2022-06-02 |
Semiconductor Structure And Method Of Fabricating The Same
App 20220165675 - Huang; Tzu-Sung ; et al. | 2022-05-26 |
Method for manufacturing a semiconductor package and method for testing bonding strength of composite specimen
Grant 11,335,579 - Wang , et al. May 17, 2 | 2022-05-17 |
Method For Removing Resistor Layer, And Method Of Manufacturing Semiconductor
App 20220100097 - Kuo; Hung-Jui ; et al. | 2022-03-31 |
Integrated Circuit, Package Structure, And Manufacturing Method Of Package Structure
App 20220068864 - Kuo; Hung-Jui ; et al. | 2022-03-03 |
Package structure and method of fabricating the same
Grant 11,251,121 - Kuo , et al. February 15, 2 | 2022-02-15 |
Semiconductor Device and Method
App 20220045254 - Yu; Chen-Hua ; et al. | 2022-02-10 |
Semiconductor structure and method of fabricating the same
Grant 11,244,906 - Huang , et al. February 8, 2 | 2022-02-08 |
Workpiece holding mechanism, process system and manufacturing method of semiconductor structure
Grant 11,232,971 - Kuo , et al. January 25, 2 | 2022-01-25 |
Package Structure Having Taper-shaped Conductive Pillar And Method Of Forming Thereof
App 20210375708 - Kuo; Hung-Jui ; et al. | 2021-12-02 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210366833 - Huang; Tzu-Sung ; et al. | 2021-11-25 |
Semiconductor Devices And Methods Of Manufacturing The Same
App 20210366826 - Kuo; Hung-Jui ; et al. | 2021-11-25 |
Semiconductor package and manufacturing process thereof
Grant 11,171,016 - Chen , et al. November 9, 2 | 2021-11-09 |
Semiconductor device and method
Grant 11,158,775 - Yu , et al. October 26, 2 | 2021-10-26 |
Method of manufacturing intergrated fan-out package with redistribution structure
Grant 11,127,701 - Kuo , et al. September 21, 2 | 2021-09-21 |
Integrated circuit package and method
Grant 11,121,106 - Kuo , et al. September 14, 2 | 2021-09-14 |
Semiconductor packages and methods of manufacturing the same
Grant 11,088,068 - Kuo , et al. August 10, 2 | 2021-08-10 |
Processes for Reducing Leakage and Improving Adhesion
App 20210242083 - Hsieh; Yun Chen ; et al. | 2021-08-05 |
Packages with Enlarged Through-Vias in Encapsulant
App 20210225722 - Kuo; Hung-Jui ; et al. | 2021-07-22 |
Semiconductor Device Having Via Sidewall Adhesion with Encapsulant
App 20210225751 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Workpiece Holding Mechanism, Process System And Manufacturing Method Of Semiconductor Structure
App 20210193499 - Kuo; Hung-Jui ; et al. | 2021-06-24 |
Integrated Circuit Package and Method
App 20210134749 - Kuo; Hung-Jui ; et al. | 2021-05-06 |
Conductive Structure, Semiconductor Package And Methods Of Forming The Same
App 20210118786 - Kuo; Hung-Jui ; et al. | 2021-04-22 |
Method Of Detecting Photoresist Scum, Method Of Fomring Semiconductor Package And Photoresist Scum Detection Apparatus
App 20210118752 - Kuo; Hung-Jui ; et al. | 2021-04-22 |
Manufacturing method of package structure
Grant 10,978,412 - Kuo , et al. April 13, 2 | 2021-04-13 |
Semiconductor device having via sidewall adhesion with encapsulant
Grant 10,971,442 - Yu , et al. April 6, 2 | 2021-04-06 |
Method For Manufacturing A Semiconductor Package And Method For Testing Bonding Strength Of Composite Specimen
App 20210098277 - Wang; Chih ; et al. | 2021-04-01 |
Method of Forming RDLS and Structure Formed Thereof
App 20210098383 - Kuo; Hung-Jui ; et al. | 2021-04-01 |
Method Of Fabrcating Package Structure
App 20210098417 - Kuo; Hung-Jui ; et al. | 2021-04-01 |
Processes for reducing leakage and improving adhesion
Grant 10,964,591 - Hsieh , et al. March 30, 2 | 2021-03-30 |
Package Structure And Method Of Fabricating The Same
App 20210090995 - Kuo; Hung-Jui ; et al. | 2021-03-25 |
Package Structure And Method Of Fabricating The Same
App 20210082858 - Tsai; Hui-Jung ; et al. | 2021-03-18 |
Semiconductor Package and Method
App 20210082745 - Kuo; Hung-Jui ; et al. | 2021-03-18 |
Manufacturing Method Of Package Structure
App 20210035928 - Kuo; Hung-Jui ; et al. | 2021-02-04 |
Method of manufacturing conductive feature and method of manufacturing package
Grant 10,892,228 - Tsai , et al. January 12, 2 | 2021-01-12 |
Method of forming RDLS and structure formed thereof
Grant 10,886,231 - Kuo , et al. January 5, 2 | 2021-01-05 |
Semiconductor packages having a seed layer structure protruding from an edge of metal structure
Grant 10,879,161 - Kuo , et al. December 29, 2 | 2020-12-29 |
Method of manufacturing semiconductor package
Grant 10,879,199 - Kuo , et al. December 29, 2 | 2020-12-29 |
Semiconductor Package And Method Of Manufacturing The Same
App 20200395319 - Kuo; Hung-Jui ; et al. | 2020-12-17 |
Alignment holder, testing apparatus and method for manufacturing a semiconductor package
Grant 10,867,827 - Wang , et al. December 15, 2 | 2020-12-15 |
Semiconductor device and method
Grant 10,867,874 - Yu , et al. December 15, 2 | 2020-12-15 |
Integrated fan-out package and method of fabricating the same
Grant 10,854,570 - Tsai , et al. December 1, 2 | 2020-12-01 |
Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus
Grant 10,847,429 - Kuo , et al. November 24, 2 | 2020-11-24 |
Semiconductor package and method
Grant 10,840,129 - Kuo , et al. November 17, 2 | 2020-11-17 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20200343179 - Kuo; Hung-Jui ; et al. | 2020-10-29 |
Semiconductor Package And Manufacturing Process Thereof
App 20200303211 - Chen; Yu-Feng ; et al. | 2020-09-24 |
Semiconductor Structures
App 20200243465 - Yu; Chen-Hua ; et al. | 2020-07-30 |
Semiconductor package and manufacturing process thereof
Grant 10,707,094 - Chen , et al. | 2020-07-07 |
Method Of Manufacturing Semiconductor Package
App 20200135673 - Kuo; Hung-Jui ; et al. | 2020-04-30 |
Semiconductor Package and Method
App 20200126850 - Kuo; Hung-Jui ; et al. | 2020-04-23 |
Semiconductor device and method
Grant 10,629,540 - Yu , et al. | 2020-04-21 |
Semiconductor structures and methods of forming the same
Grant 10,622,321 - Yu , et al. | 2020-04-14 |
Alignment Holder, Testing Apparatus And Method For Manufacturing A Semiconductor Package
App 20200105567 - Wang; Chih ; et al. | 2020-04-02 |
Conductive Structures, Semiconductor Packages And Methods Of Forming The Same
App 20200075470 - Kuo; Hung-Jui ; et al. | 2020-03-05 |
Semiconductor Structure and Method of Forming the Same
App 20200051949 - Tsai; Hui-Jung ; et al. | 2020-02-13 |
Semiconductor Device and Method
App 20200027838 - Yu; Chen-Hua ; et al. | 2020-01-23 |
Semiconductor Structure and Method of Forming the Same
App 20200013750 - Tsai; Hui-Jung ; et al. | 2020-01-09 |
Method of Forming RDLS and Structure Formed Thereof
App 20200006240 - Kuo; Hung-Jui ; et al. | 2020-01-02 |
Semiconductor structure and method of forming the same
Grant 10,522,501 - Tsai , et al. Dec | 2019-12-31 |
Semiconductor package and method
Grant 10,515,848 - Kuo , et al. Dec | 2019-12-24 |
Semiconductor Device and Method
App 20190378962 - Yu; Chen-Hua ; et al. | 2019-12-12 |
Semiconductor Structures And Methods Of Forming The Same
App 20190371751 - Yu; Chen-Hua ; et al. | 2019-12-05 |
Processes for Reducing Leakage and Improving Adhesion
App 20190326167 - Hsieh; Yun Chen ; et al. | 2019-10-24 |
Semiconductor Device Having Via Sidewall Adhesion With Encapsulant
App 20190318986 - Yu; Chen-Hua ; et al. | 2019-10-17 |
Methods Of Manufacturing Conductive Feature And Method Of Manufacturing Package
App 20190273045 - Tsai; Hui-Jung ; et al. | 2019-09-05 |
Semiconductor Package And Manufacturing Process Thereof
App 20190252209 - Chen; Yu-Feng ; et al. | 2019-08-15 |
Processes for reducing leakage and improving adhesion
Grant 10,361,122 - Hsieh , et al. | 2019-07-23 |
Semiconductor Device and Method
App 20190214317 - Yu; Chen-Hua ; et al. | 2019-07-11 |
Dense redistribution layers in semiconductor packages and methods of forming the same
Grant 10,340,206 - Yu , et al. | 2019-07-02 |
Three-step Etching to Form RDL
App 20190157240 - Tsai; Hui-Jung ; et al. | 2019-05-23 |
Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package
Grant 10,297,551 - Tsai , et al. | 2019-05-21 |
Semiconductor package and manufacturing process thereof
Grant 10,276,402 - Chen , et al. | 2019-04-30 |
Dense Redistribution Layers in Semiconductor Packages and Methods of Forming the Same
App 20190096790 - Yu; Chen-Hua ; et al. | 2019-03-28 |
Semiconductor Device and Method
App 20190096817 - Yu; Chen-Hua ; et al. | 2019-03-28 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20190035759 - Tsai; Hui-Jung ; et al. | 2019-01-31 |
Semiconductor device and method
Grant 10,186,462 - Yu , et al. Ja | 2019-01-22 |
Semiconductor Device and Method
App 20180151453 - Yu; Chen-Hua ; et al. | 2018-05-31 |
Method Of Manufacturing Redistribution Circuit Structure And Method Of Manufacturing Integrated Fan-out Package
App 20180047674 - Tsai; Hui-Jung ; et al. | 2018-02-15 |
Dense Redistribution Layers In Semiconductor Packages And Methods Of Forming The Same
App 20180040546 - Yu; Chen-Hua ; et al. | 2018-02-08 |
Semicondcutor Package And Manufacturing Process Thereof
App 20170271248 - Chen; Yu-Feng ; et al. | 2017-09-21 |
Cleaning methods and compositions
Grant 9,765,289 - Tsai , et al. September 19, 2 | 2017-09-19 |
Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
Grant 9,685,372 - Hwang , et al. June 20, 2 | 2017-06-20 |
Method Of Forming Cu Pillar Bump With Non-metal Sidewall Spacer And Metal Top Cap
App 20150228533 - HWANG; Chien Ling ; et al. | 2015-08-13 |
Cu pillar bump with non-metal sidewall spacer and metal top cap
Grant 9,018,758 - Hwang , et al. April 28, 2 | 2015-04-28 |
Cleaning Methods and Compositions
App 20130276837 - Tsai; Hui-Jung ; et al. | 2013-10-24 |
Doping Minor Elements into Metal Bumps
App 20120286423 - Cheng; Ming-Da ; et al. | 2012-11-15 |
Doping minor elements into metal bumps
Grant 8,227,334 - Cheng , et al. July 24, 2 | 2012-07-24 |
Doping Minor Elements into Metal Bumps
App 20120018878 - Cheng; Ming-Da ; et al. | 2012-01-26 |
Cu Pillar Bump With Non-metal Sidewall Spacer And Metal Top Cap
App 20110298123 - HWANG; Chien Ling ; et al. | 2011-12-08 |
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