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Tsai; Hsin-Lun Patent Filings

Tsai; Hsin-Lun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Hsin-Lun.The latest application filed is for "structure for touch electrode substrate and manufacturing method thereof".

Company Profile
0.4.8
  • Tsai; Hsin-Lun - New Taipei TW
  • TSAI; Hsin-Lun - Zhongli City TW
  • TSAI; Hsin Lun - Taoyuan County TW
  • Tsai; Hsin-Lun - New Taipei City TW
  • Tsai; Hsin-Lun - Taipei Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Temperature measuring board device and temperature measuring board thereof
Grant 9,810,582 - Hsieh , et al. November 7, 2
2017-11-07
Structure For Touch Electrode Substrate And Manufacturing Method Thereof
App 20160139703 - TSAI; Hsin-Lun
2016-05-19
Manufacturing Method And Structure Of Circuit Board With Very Fine Conductive Circuit Lines
App 20160100487 - TSAI; Hsin Lun
2016-04-07
Temperature Measuring Board Device And Temperature Measuring Board Thereof
App 20150323393 - Hsieh; Hao-Chun ;   et al.
2015-11-12
Testing Apparatus And Testing Method
App 20140298898 - YANG; Jun-Min ;   et al.
2014-10-09
Method for assembling components on a circuit board
Grant 8,656,583 - Yang , et al. February 25, 2
2014-02-25
Method For Assembling Components On A Circuit Board
App 20130133192 - Yang; Jun-Min ;   et al.
2013-05-30
System for assembling components on a circuit board
Grant 8,387,233 - Yang , et al. March 5, 2
2013-03-05
Printed Circuit Board, A Supporting Jig And A Positioning Method
App 20120261870 - HSIEH; Hao-Chun ;   et al.
2012-10-18
Heat dissipation module and portable device having the heat dissipation module
App 20110155361 - Yang; Jun-Min ;   et al.
2011-06-30
Method For Assembling Components On A Circuit Board And Related Assembling System
App 20110016708 - Yang; Jun-Min ;   et al.
2011-01-27

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