Tsai; Fu-Shou
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Fu-Shou.The latest application filed is for "fabricating method of transistors without dishing occurred during cmp process".
- Tsai; Fu-Shou - Keelung City TW
- Tsai; Fu-Shou - Keelung TW
- Tsai; Fu-Shou - Keeling TW
| Patent | Date |
|---|---|
| Fabricating Method Of Transistors Without Dishing Occurred During Cmp Process App 20220084878 - Tsai; Fu-Shou ; et al. | 2022-03-17 |
| Fabricating method of transistors without dishing occurred during CMP process Grant 11,257,711 - Tsai , et al. February 22, 2 | 2022-02-22 |
| Method of manufacturing a semiconductor device Grant 11,211,471 - Tsai , et al. December 28, 2 | 2021-12-28 |
| Method Of Forming Gate App 20210273076 - Lu; Yang-Ju ; et al. | 2021-09-02 |
| Method for forming semiconductor integrated circuit structure Grant 10,943,910 - Li , et al. March 9, 2 | 2021-03-09 |
| Semiconductor integrated circuit structure Grant 10,923,481 - Li , et al. February 16, 2 | 2021-02-16 |
| Planarization method Grant 10,734,276 - Huang , et al. | 2020-08-04 |
| Wafer polishing pad and using method thereof Grant 10,722,998 - Hsu , et al. | 2020-07-28 |
| Wafer Polishing Pad And Using Method Thereof App 20190070706 - Hsu; Li-Chieh ; et al. | 2019-03-07 |
| Method For Forming Semiconductor Integrated Circuit Structure App 20190043866 - Li; Yu-Ting ; et al. | 2019-02-07 |
| Semiconductor Integrated Circuit Structure App 20190035794 - Li; Yu-Ting ; et al. | 2019-01-31 |
| Conductive layout structure including high resistive layer Grant 10,192,826 - Li , et al. Ja | 2019-01-29 |
| Semiconductor integrated circuit structure and method for forming the same Grant 10,128,251 - Li , et al. November 13, 2 | 2018-11-13 |
| Method of planarizing substrate surface Grant 10,103,034 - Hsu , et al. October 16, 2 | 2018-10-16 |
| Method of planarizing substrate surface Grant 10,049,887 - Hsu , et al. August 14, 2 | 2018-08-14 |
| Planarization Method App 20180197749 - Huang; Po-Cheng ; et al. | 2018-07-12 |
| Conductive Structure, Layout Structure Including Conductive Structure, And Method For Manufacturing Conductive Structure App 20180138125 - Li; Kun-Ju ; et al. | 2018-05-17 |
| Method of fabricating a gate cap layer Grant 9,972,498 - Tsai , et al. May 15, 2 | 2018-05-15 |
| Semiconductor Integrated Circuit Structure And Method For Forming The Same App 20180076205 - Li; Yu-Ting ; et al. | 2018-03-15 |
| Method For Forming Semiconductor Structure App 20180061656 - Tsai; Fu-Shou ; et al. | 2018-03-01 |
| Method for forming semiconductor structure Grant 9,905,430 - Tsai , et al. February 27, 2 | 2018-02-27 |
| Conductive structure having an entrenched high resistive layer Grant 9,887,158 - Li , et al. February 6, 2 | 2018-02-06 |
| Method Of Fabricating A Semiconductor Structure App 20180033636 - Hsu; Li-Chieh ; et al. | 2018-02-01 |
| Method For Planarizing Material Layer App 20180033633 - Tsai; Fu-Shou ; et al. | 2018-02-01 |
| Method for planarizing material layer Grant 9,875,909 - Tsai , et al. January 23, 2 | 2018-01-23 |
| Method Of Planarizing Substrate Surface App 20180012772 - Hsu; Li-Chieh ; et al. | 2018-01-11 |
| Method Of Planarizing Substrate Surface App 20180012771 - Hsu; Li-Chieh ; et al. | 2018-01-11 |
| Method of planarizing substrate surface Grant 9,773,682 - Hsu , et al. September 26, 2 | 2017-09-26 |
| Method Of Fabricating A Gate Cap Layer App 20170162396 - Tsai; Fu-Shou ; et al. | 2017-06-08 |
| Method Of Manufacturing A Semiconductor Structure App 20170162402 - Tsai; Fu-Shou ; et al. | 2017-06-08 |
| Method for fabricating semiconductor device Grant 9,673,053 - Lee , et al. June 6, 2 | 2017-06-06 |
| Method for manufacturing semiconductor device with a barrier layer having overhung portions Grant 9,502,303 - Li , et al. November 22, 2 | 2016-11-22 |
| Method For Manufacturing Semiconductor Device App 20160300765 - Li; Kun-Ju ; et al. | 2016-10-13 |
| Manufacturing method of semiconductor device Grant 9,466,484 - Li , et al. October 11, 2 | 2016-10-11 |
| Method For Fabricating Semiconductor Device App 20160148816 - Lee; Rung-Yuan ; et al. | 2016-05-26 |
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