Tsai; Fang-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Fang-Lin.The latest application filed is for "electronic package and circuit structure thereof".

Company Profile

2.10.12

Tsai; Fang-Lin - Taichung City TW
Tsai; Fang-Lin - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Package And Circuit Structure Thereof App 20220148996 - Tsai; Fang-Lin ; et al.	2022-05-12
Fabrication method of layer structure for mounting semiconductor device Grant 10,396,021 - Tsai , et al. A	2019-08-27
Electronic package and method for fabricating the same Grant 10,236,261 - Tsai , et al.	2019-03-19
Fabrication Method Of Layer Structure For Mounting Semiconductor Device App 20180233442 - Tsai; Fang-Lin ; et al.	2018-08-16
Electronic Package And Method For Fabricating The Same App 20180211925 - Tsai; Fang-Lin ; et al.	2018-07-26
Layer structure for mounting semiconductor device and fabrication method thereof Grant 9,972,564 - Tsai , et al. May 15, 2	2018-05-15
Layer Structure For Mounting Semiconductor Device And Fabrication Method Thereof App 20150206814 - Tsai; Fang-Lin ; et al.	2015-07-23
Method for fabricating stack structure of semiconductor packages Grant 8,420,521 - Tsai , et al. April 16, 2	2013-04-16
Electronic carrier board and package structure thereof Grant 8,013,443 - Tsai , et al. September 6, 2	2011-09-06
Method For Fabricating Stack Structure Of Semiconductor Packages App 20110070697 - Tsai; Fang-Lin ; et al.	2011-03-24
Electronic carrier board applicable to surface mount technology Grant 7,889,511 - Tsai , et al. February 15, 2	2011-02-15
Stack structure of semiconductor packages and method for fabricating the stack structure Grant 7,855,443 - Tsai , et al. December 21, 2	2010-12-21
Electronic Carrier Board And Package Structure Thereof App 20100170709 - Tsai; Fang-Lin ; et al.	2010-07-08
Electronic carrier board and package structure thereof Grant 7,696,623 - Tsai , et al. April 13, 2	2010-04-13
Electronic Carrier Board App 20090288866 - Tsai; Fang-Lin ; et al.	2009-11-26
Electronic carrier board applicable to surface mounted technology (SMT) Grant 7,573,722 - Tsai , et al. August 11, 2	2009-08-11
Stack structure of semiconductor packages and method for fabricating the stack structure App 20070246811 - Tsai; Fang-Lin ; et al.	2007-10-25
Semiconductor package and method for fabricating the same App 20070202633 - Tseng; Wen-Tsung ; et al.	2007-08-30
Electronic carrier board App 20070164084 - Tsai; Fang-Lin ; et al.	2007-07-19
Electronic carrier board and package structure thereof App 20070145561 - Tsai; Fang-Lin ; et al.	2007-06-28
Electronic carrier board and package structure thereof App 20070138632 - Tsai; Fang-Lin ; et al.	2007-06-21

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