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Patent applications and USPTO patent grants for Tsai; Chun Yuan.The latest application filed is for "semiconductor package".
Patent | Date |
---|---|
Semiconductor package having improved package-on-package interconnection Grant 10,032,652 - Hsu , et al. July 24, 2 | 2018-07-24 |
Semiconductor package including substrates spaced by at least one electrical connecting element Grant 9,922,917 - Yu , et al. March 20, 2 | 2018-03-20 |
Semiconductor Package App 20160372397 - YU; Cheng-Hsien ;   et al. | 2016-12-22 |
Semiconductor package Grant 9,443,785 - Yu , et al. September 13, 2 | 2016-09-13 |
Semiconductor Package App 20160181176 - YU; Cheng-Hsien ;   et al. | 2016-06-23 |
Semiconductor Package And Method Of Manufacturing The Same App 20160163612 - HSU; Wen Tsung ;   et al. | 2016-06-09 |
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