TSAI; Chun-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSAI; Chun-Wei.The latest application filed is for "ejector device".
- TSAI; Chun-Wei - Taoyuan City TW
- Tsai; Chun Wei - Taichung City TW
- Tsai; Chun-Wei - Hualien County TW
- Tsai; Chun-Wei - Hualien TW
- Tsai, Chun-Wei - Hualien City TW
| Patent | Date |
|---|---|
| Ejector Device App 20200357678 - TSAI; Chun-Wei | 2020-11-12 |
| Mobile Financial Transaction System And Method App 20140089178 - Lee; Tien Chi ; et al. | 2014-03-27 |
| Wafer-level packaging cutting method capable of protecting contact pads Grant 7,622,334 - Tsai , et al. November 24, 2 | 2009-11-24 |
| Method of fabricating optical device caps Grant 7,528,000 - Tsai May 5, 2 | 2009-05-05 |
| Wafer-level Packaging Cutting Method Capable Of Protecting Contact Pads App 20090061598 - Tsai; Chun-Wei ; et al. | 2009-03-05 |
| Method Of Fabricating Optical Device Caps App 20080213937 - Tsai; Chun-Wei | 2008-09-04 |
| Tunable optical add-drop multiplexer based on SOI wafer and manufacturing method thereof Grant 7,324,725 - Tsao , et al. January 29, 2 | 2008-01-29 |
| Tunable optical add-drop multiplexer based on SOI wafer and manufacturing method thereof App 20040234267 - Tsao, Shyh-Lin ; et al. | 2004-11-25 |
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