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Tsai; Ching-Ming Patent Filings

Tsai; Ching-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Ching-Ming.The latest application filed is for "polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith".

Company Profile
0.6.5
  • Tsai; Ching-Ming - Aurora IL
  • Tsai; Ching-Ming - Jhudong Township TW
  • Tsai; Ching-Ming - Fongtian Jhuolan Township TW
  • Tsai, Ching-Ming - Miao Li County TW
  • Tsai, Ching-Ming - Miaoli TW
  • Tsai; Ching-Ming - Miao Li TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith
Grant 9,687,956 - Tsai , et al. June 27, 2
2017-06-27
CMP polishing pad having edge exclusion region of offset concentric groove pattern
Grant 9,409,276 - Tsai , et al. August 9, 2
2016-08-09
Polishing Pad With Offset Concentric Grooving Pattern And Method For Polishing A Substrate Therewith
App 20150298287 - Tsai; Ching-Ming ;   et al.
2015-10-22
Cmp Polishing Pad Having Edge Exclusion Region Of Offset Concentric Groove Pattern
App 20150111476 - TSAI; Ching-Ming ;   et al.
2015-04-23
Barrier-slurry-free copper CMP process
Grant RE45,468 - Chen , et al. April 14, 2
2015-04-14
Grooved Cmp Polishing Pad
App 20110014858 - TSAI; Ching-Ming ;   et al.
2011-01-20
Method of chemical-mechanical polishing
App 20050112895 - Chen, Yi-Chen ;   et al.
2005-05-26
Process for forming metal damascene structure to prevent dielectric layer peeling
App 20050059233 - Wang, Ming-Tsong ;   et al.
2005-03-17
Barrier-slurry-free copper CMP process
Grant 6,830,504 - Chen , et al. December 14, 2
2004-12-14
Feed forward process control method for adjusting metal line Rs
Grant 6,756,309 - Chen , et al. June 29, 2
2004-06-29

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