Tsai; Chi-Long

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Chi-Long.The latest application filed is for "chip packaging structure".

Company Profile

0.11.18

Tsai; Chi-Long - Kaohsiung TW
Tsai; Chi-Long - Kao-Hsiung TW
Tsai; Chi-Long - Taitung County TW
Tsai; Chi-Long - Kaohsiung City TW
Tsai; Chi-Long - Taitung TW
Tsai; Chi-Long - Kao-Hsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication method of a wafer structure Grant 7,501,311 - Tsai March 10, 2	2009-03-10
Method for forming bump protective collars on a bumped wafer Grant 7,473,998 - Tsai January 6, 2	2009-01-06
Structure of bumps forming on an under metallurgy layer and method for making the same Grant 7,432,188 - Tsai , et al. October 7, 2	2008-10-07
Etchant and method for forming bumps Grant 7,402,510 - Wu , et al. July 22, 2	2008-07-22
Chip Packaging Structure App 20070252275 - Huang; Min-Lung ; et al.	2007-11-01
Method for manufacturing bump of wafer level package App 20070218675 - Tsai; Chi-Long	2007-09-20
Bumping process Grant 7,261,828 - Wu , et al. August 28, 2	2007-08-28
Chip packaging structure having redistribution layer with recess Grant 7,253,519 - Huang , et al. August 7, 2	2007-08-07
Method for mounting bumps on an under metallurgy layer App 20070134905 - Tsai; Chi-Long ; et al.	2007-06-14
Structure of bumps forming on an under metallurgy layer and method for making the same App 20070117368 - Tsai; Chi-Long ; et al.	2007-05-24
Etchant And Method For Forming Bumps App 20070087546 - Wu; En-Chieh ; et al.	2007-04-19
Method for forming bump protective collars on a bumped wafer App 20070015312 - Tsai; Chi-Long	2007-01-18
Method for forming bump protective collars on a bumped wafer Grant 7,129,111 - Tsai October 31, 2	2006-10-31
Method for treating wafer surface Grant 7,105,433 - Tsai , et al. September 12, 2	2006-09-12
Formation method for conductive bump Grant 7,041,590 - Tseng , et al. May 9, 2	2006-05-09
Fabrication method of a wafer structure App 20060094223 - Tsai; Chi-Long	2006-05-04
Method for making UBM pads and bumps on wafer Grant 7,015,130 - Tsai , et al. March 21, 2	2006-03-21
Formation method for conductive bump App 20050272242 - Tseng, Tsung-Yen ; et al.	2005-12-08
Wafer bumping process Grant 6,921,716 - Huang , et al. July 26, 2	2005-07-26
[process For Fabricating Bumps] App 20050016859 - Huang, Min-Lung ; et al.	2005-01-27
Method for forming bump protective collars on a bumped wafer App 20050020051 - Tsai, Chi-Long	2005-01-27
IC chip with improved pillar bumps App 20050017376 - Tsai, Chi-Long	2005-01-27
[flip-chip Package Substrate And Flip-chip Bonding Process Thereof] App 20040256737 - Huang, Min-Lung ; et al.	2004-12-23
[chip Structure] App 20040245630 - Huang, Min-Lung ; et al.	2004-12-09
[method For Treating Wafer Surface] App 20040229474 - Tsai, Chi-Long ; et al.	2004-11-18
Bumping process App 20040188378 - Wu, En-Chieh ; et al.	2004-09-30
[under Bump Metallurgy Layer] App 20040183195 - Huang, Min-Lung ; et al.	2004-09-23
[a Wafer Bumping Process] App 20040185649 - HUANG, MIN-LUNG ; et al.	2004-09-23
Method for making UBM pads and bumps on wafer App 20040110364 - Tsai, Chi-Long ; et al.	2004-06-10

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.