loadpatents
Patent applications and USPTO patent grants for Tsai; Cheng-Hsiung Matthew.The latest application filed is for "methods and apparatus for precleaning and treating wafer surfaces".
Patent | Date |
---|---|
Base plate for a processing chamber substrate support Grant D960,216 - Rao , et al. August 9, 2 | 2022-08-09 |
Base plate for a processing chamber substrate support Grant D947,914 - Rao , et al. April 5, 2 | 2022-04-05 |
Methods And Apparatus For Precleaning And Treating Wafer Surfaces App 20210371972 - XIE; Xiangjin ;   et al. | 2021-12-02 |
Lift pin assembly Grant 10,892,180 - Chia , et al. January 12, 2 | 2021-01-12 |
Detachable Biasable Electrostatic Chuck For High Temperature Applications App 20200411354 - RAO; Shreesha Yogish ;   et al. | 2020-12-31 |
Substrate support for plasma etch operations Grant 10,593,521 - Frazier , et al. | 2020-03-17 |
Electrostatic chuck Grant 9,608,549 - Parkhe , et al. March 28, 2 | 2017-03-28 |
Two piece shutter disk assembly for a substrate process chamber Grant 9,252,002 - Tsai , et al. February 2, 2 | 2016-02-02 |
Substrate Support With More Uniform Edge Purge App 20160002778 - RAVI; JALLEPALLY ;   et al. | 2016-01-07 |
Lift Pin Assembly App 20150348823 - CHIA; BONNIE T. ;   et al. | 2015-12-03 |
Finned shutter disk for a substrate process chamber Grant 9,147,558 - Chia , et al. September 29, 2 | 2015-09-29 |
Electrostatic chuck with temperature control Grant 8,971,009 - Parkhe , et al. March 3, 2 | 2015-03-03 |
Substrate Support For Plasma Etch Operations App 20140262043 - FRAZIER; LARRY ;   et al. | 2014-09-18 |
Finned Shutter Disk For A Substrate Process Chamber App 20140196848 - CHIA; BONNIE T. ;   et al. | 2014-07-17 |
Two Piece Shutter Disk Assembly For A Substrate Process Chamber App 20140020629 - TSAI; CHENG-HSIUNG MATTHEW ;   et al. | 2014-01-23 |
Electrostatic Chuck App 20130088808 - PARKHE; VIJAY D. ;   et al. | 2013-04-11 |
Electrostatic Chuck With Temperature Control App 20130088809 - PARKHE; VIJAY D. ;   et al. | 2013-04-11 |
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