loadpatents
name:-0.05591082572937
name:-0.039021968841553
name:-0.0016880035400391
Tsai; Chen Jung Patent Filings

Tsai; Chen Jung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Chen Jung.The latest application filed is for "device for reducing speckle effect in a display system".

Company Profile
0.24.43
  • Tsai; Chen Jung - Hsinchu TW
  • TSAI; Chen Jung - Hong Kong HK
  • Tsai; Chen-Jung - Shatin HK
  • Tsai; Chen-Jung - New Territories HK
  • Tsai; Chen Jung - Judung TW
  • Tsai; Chen-Jung - Hong Kong SAR CN
  • Tsai; Chen-Jung - Hsin-chu TW
  • Tsai, Chen-Jung - Tainan City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ultra thin image sensor package structure and method for fabrication
Grant 8,558,357 - Tsai , et al. October 15, 2
2013-10-15
Device For Reducing Speckle Effect In A Display System
App 20120206784 - CHAN; Yick Chuen ;   et al.
2012-08-16
Image display device and method
Grant 8,243,007 - Zhang , et al. August 14, 2
2012-08-14
Backlight device and liquid crystal display incorporating the backlight device
Grant 8,228,272 - Peng , et al. July 24, 2
2012-07-24
Method of displaying a low dynamic range image in a high dynamic range
Grant 8,207,931 - Zhang , et al. June 26, 2
2012-06-26
Methods and apparatus for backlight calibration
Grant 8,044,899 - Ng , et al. October 25, 2
2011-10-25
Method and apparatus for stacking electrical components using via to provide interconnection
Grant 7,892,888 - Tsai , et al. February 22, 2
2011-02-22
Total internal reflection side emitting coupling device
Grant 7,841,739 - Liu , et al. November 30, 2
2010-11-30
Light guiding strip and backlight module and display using the same
Grant 7,828,472 - Liu , et al. November 9, 2
2010-11-09
Sensing System for a Touch Sensitive Device
App 20100277436 - Feng; Yaojun ;   et al.
2010-11-04
Method and apparatus for stacking electrical components using via to provide interconnection
Grant 7,755,188 - Tsai , et al. July 13, 2
2010-07-13
Touch Surface And System And Method Of Detecting Touch Input
App 20100170725 - Au-Yeung; Amy Mei Sze ;   et al.
2010-07-08
Light-emitting devices and lens therefor
Grant 7,607,792 - Liu , et al. October 27, 2
2009-10-27
Ultra Thin Image Sensor Package Structure And Method For Fabrication
App 20090174049 - TSAI; CHEN JUNG ;   et al.
2009-07-09
Method Of Determining Luminance Values For A Backlight Of An Lcd Panel Displaying An Image
App 20090167670 - Peng; Huajun ;   et al.
2009-07-02
Method and apparatus for image display with backlight illumination
App 20090122001 - Cheung; Yuk Lung ;   et al.
2009-05-14
Ultra thin image sensor package structure and method for fabrication
Grant 7,521,783 - Tsai , et al. April 21, 2
2009-04-21
Backlight assembly, method of driving the same and display system having the same thereof
App 20090051642 - Huang; Danding ;   et al.
2009-02-26
Chip stacking structure
Grant 7,495,327 - Tsai , et al. February 24, 2
2009-02-24
Method And Apparatus For Stacking Electrical Components Using Via To Provide Interconnection
App 20090032923 - Tsai; Chen Jung ;   et al.
2009-02-05
Methods and apparatus for backlight calibration
App 20090001251 - Ng; Pak Hong ;   et al.
2009-01-01
Method and apparatus for stacking electrical components using via to provide interconnection
Grant 7,462,925 - Tsai , et al. December 9, 2
2008-12-09
Method of displaying a low dynamic range image in a high dynamic range
App 20080297460 - Peng; Huajun ;   et al.
2008-12-04
Image Display Device And Method
App 20080291153 - Zhang; Wei ;   et al.
2008-11-27
Back-Light Devices and Displays Incorporating Same
App 20080238336 - Peng; Huajun ;   et al.
2008-10-02
High Dynamic Range Image Recorder
App 20080198235 - CHEN; Shou-Lung ;   et al.
2008-08-21
Side-emitting backlight system and backlit display using the same
App 20080186734 - Huang; Danding ;   et al.
2008-08-07
Backlit Display and Backlight System Thereof
App 20080186272 - Huang; Danding ;   et al.
2008-08-07
Method And Light Emitting Diode Backlight System With Adjustable Color Gamut
App 20080164823 - HUANG; Danding ;   et al.
2008-07-10
Total Internal Reflection Side Emitting Coupling Device
App 20080158881 - LIU; Ying ;   et al.
2008-07-03
Backlight device and liquid crystal display incorporating the backlight device
App 20080150853 - Peng; Huanjun ;   et al.
2008-06-26
Flat panel display and driving method thereof
App 20080150881 - Chen; Shou Lung ;   et al.
2008-06-26
Light-emitting devices and lens therefor
App 20080151550 - Liu; Ying ;   et al.
2008-06-26
Light guiding strip and backlight module and display using the same
App 20080130314 - Liu; Ying ;   et al.
2008-06-05
Image display apparatus
App 20080122832 - Chen; Shou Lung ;   et al.
2008-05-29
Method and apparatus for stacking electrical components using via to provide interconnection
App 20070259482 - Tsai; Chen Jung ;   et al.
2007-11-08
Dual chips stacked packaging structure
Grant 7,291,927 - Tsai , et al. November 6, 2
2007-11-06
Ultra thin dual chip image sensor package structure and method for fabrication
Grant 7,259,042 - Tsai , et al. August 21, 2
2007-08-21
Ultra thin dual chip image sensor package structure and method for fabrication
Grant 7,227,253 - Tsai , et al. June 5, 2
2007-06-05
Apparatus for stacking electrical components using insulated and interconnecting via
Grant 7,217,995 - Tsai , et al. May 15, 2
2007-05-15
Method and apparatus for stacking electrical components using via to provide interconnection
App 20070069350 - Tsai; Chen Jung ;   et al.
2007-03-29
Multi-chip stacking package structure
App 20070052079 - Tsai; Chen-Jung ;   et al.
2007-03-08
Semiconductor Packaging Device And Manufacture Thereof
App 20070018333 - TSAI; Chen-Jung ;   et al.
2007-01-25
Ultra thin image sensor package structure and method for fabrication
App 20060261428 - Tsai; Chen Jung ;   et al.
2006-11-23
Semiconductor packaging device and manufacture thereof
Grant 7,122,904 - Tsai , et al. October 17, 2
2006-10-17
Ultra thin image sensor package structure and method for fabrication
Grant 7,102,159 - Tsai , et al. September 5, 2
2006-09-05
Ultra thin dual chip image sensor package structure and method for fabrication
App 20060192279 - Tsai; Chen Jung ;   et al.
2006-08-31
Method and apparatus for stacking electrical components using via to provide interconnection
App 20060102993 - Tsai; Chen Jung ;   et al.
2006-05-18
Apparatus For Stacking Electrical Components Using Insulated And Interconnecting Via
App 20060102995 - Tsai; Chen Jung ;   et al.
2006-05-18
Ultra thin dual chip image sensor package structure and method for fabrication
Grant 7,045,888 - Tsai , et al. May 16, 2
2006-05-16
Ultra thin dual chip image sensor package structure and method for fabrication
App 20050285239 - Tsai, Chen Jung ;   et al.
2005-12-29
Semiconductor packaging device
Grant 6,977,436 - Tsai , et al. December 20, 2
2005-12-20
Ultra thin image sensor package structure and method for fabrication
App 20050275050 - Tsai, Chen Jung ;   et al.
2005-12-15
Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
Grant 6,972,372 - Tsai , et al. December 6, 2
2005-12-06
Method And Apparatus For Stacking Electrical Components Using Outer Lead Portions And Exposed Inner Lead Portions To Provide Interconnection
App 20050263311 - Tsai, Chen-Jung ;   et al.
2005-12-01
Semiconductor packaging structure
App 20050012184 - Tsai, Chen-Jung ;   et al.
2005-01-20
Dual chips stacked packaging structure
App 20050001328 - Tsai, Chen-Jung ;   et al.
2005-01-06
Ultra thin stacking packaging device
App 20040021230 - Tsai, Chen-Jung ;   et al.
2004-02-05
Semiconductor package body having a lead frame with enhanced heat dissipation
App 20040000703 - Lee, Jui-chung ;   et al.
2004-01-01
Stacked semiconductor packaging device
Grant 6,650,008 - Tsai , et al. November 18, 2
2003-11-18
Semiconductor packaging device and manufacture thereof
App 20030201521 - Tsai, Chen-Jung ;   et al.
2003-10-30
Stacked Semiconductor Packaging Device
App 20030183917 - Tsai, Chen-Jung ;   et al.
2003-10-02
Semiconductor packaging device and manufacture thereof
App 20030151143 - Tsai, Chen-Jung ;   et al.
2003-08-14
Three-dimension multi-chip stack package technology
App 20020180020 - Lin, Chih-Wen ;   et al.
2002-12-05
Three-dimension multi-chip stack package technology
App 20020180021 - Lin, Chih-Wen ;   et al.
2002-12-05
Multiple-step inner lead of leadframe
App 20020158316 - Lee, Jui-Chung ;   et al.
2002-10-31

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