Tsai; Chang Chin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Chang Chin.The latest application filed is for "semiconductor package structure and method for manufacturing the same".

Company Profile

5.4.6

Tsai; Chang Chin - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package structure including an encapsulant having a cavity exposing an interposer Grant 11,410,915 - Huang , et al. August 9, 2	2022-08-09
Semiconductor Package Structure And Method For Manufacturing The Same App 20220139812 - HUANG; Yu-Che ; et al.	2022-05-05
Semiconductor Device Package And Method Of Manufacturing The Same App 20210257246 - MA; Wei Ling ; et al.	2021-08-19
Semiconductor package with inner and outer cavities Grant 11,081,413 - Wu , et al. August 3, 2	2021-08-03
Semiconductor device package, optical package, and method for manufacturing the same Grant 10,770,624 - Tsai , et al. Sep	2020-09-08
Optical Device App 20200035851 - TSAI; Chang Chin ; et al.	2020-01-30
Lid array panel, package with lid and method of making the same Grant 10,453,760 - Tsai , et al. Oc	2019-10-22
Semiconductor Package Structure And Method For Manufacturing The Same App 20190267298 - WU; Hsin Lin ; et al.	2019-08-29
Semiconductor Device Package, Optical Package, And Method For Manufacturing The Same App 20190115505 - TSAI; Chang Chin ; et al.	2019-04-18
Lid Array Panel, Package With Lid And Method Of Making The Same App 20170294361 - TSAI; Chang Chin ; et al.	2017-10-12

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