loadpatents
name:-0.02125096321106
name:-0.011859893798828
name:-0.0072588920593262
Tsai; Bor-Chen Patent Filings

Tsai; Bor-Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Bor-Chen.The latest application filed is for "electrical connection assembly".

Company Profile
6.13.18
  • Tsai; Bor-Chen - New Taipei TW
  • TSAI; BOR-CHEN - NEW TAIPEI CITY TW
  • TSAI; BOR-CHEN - ZHUBEI CITY TW
  • Tsai; Bor-Chen - Taipei N/A TW
  • TSAI; BOR-CHEN - TAIPEI CITY TW
  • TSAI; Bor-Chen - Tainan City TW
  • Tsai; Bor-Chen - Tainan TW
  • Tsai; Bor-Chen - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wearable device and electrical connector with magnetic attraction
Grant 11,226,494 - Lin , et al. January 18, 2
2022-01-18
Electrical connection assembly
Grant 11,226,352 - Wu , et al. January 18, 2
2022-01-18
Insulator applied in a probe base and the probe base
Grant 11,143,675 - Hsieh , et al. October 12, 2
2021-10-12
Electrical Connection Assembly
App 20200379008 - WU; SHU-LIN ;   et al.
2020-12-03
Supplementary Bushing, Test Probe, And Supplementary Testing Device
App 20200348339 - WU; MING-DAO ;   et al.
2020-11-05
Test Pin Contact Buffer
App 20200348338 - WU; MING-DAO ;   et al.
2020-11-05
Wearable Device And Electrical Connector With Magnetic Attraction
App 20200271953 - LIN; YEN-WEI ;   et al.
2020-08-27
Insulator Applied In A Probe Base And The Probe Base
App 20190317129 - HSIEH; CHIEN-YU ;   et al.
2019-10-17
High Frequency Electronic Connector
App 20190020151 - CHIEN; HAO-WEN ;   et al.
2019-01-17
Magnetic automobile vehicle device and multifunctional module thereof
Grant 9,991,629 - Chien , et al. June 5, 2
2018-06-05
Connector assembly
Grant 9,130,317 - Wang , et al. September 8, 2
2015-09-08
Connector Assembly
App 20150017831 - Wang; Hsin-Chieh ;   et al.
2015-01-15
Electrical contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite
Grant 8,603,366 - Hung , et al. December 10, 2
2013-12-10
Electrical Contact Material Of Silver Matrix Capable Of Resisting Arc Erosion And Containing No Cadmium-composite
App 20120132869 - HUNG; CHIN-WEI ;   et al.
2012-05-31
Wafer level sensing package and manufacturing process thereof
Grant 7,915,065 - Chen , et al. March 29, 2
2011-03-29
Projector
Grant 7,837,333 - Chou , et al. November 23, 2
2010-11-23
Electrode And Method For Forming The Same
App 20090133903 - HU; Ying-Chiang ;   et al.
2009-05-28
Wafer Level Sensing Package And Manufacturing Process Thereof
App 20090124074 - Chen; Lung-Tai ;   et al.
2009-05-14
Wafer level sensing package and manufacturing process thereof
App 20090121299 - Chen; Lung-Tai ;   et al.
2009-05-14
Electrode and method for forming the same
Grant 7,501,149 - Hu , et al. March 10, 2
2009-03-10
Flexible Biomonitor With Emi Shielding And Module Expansion
App 20080259577 - HU; YING-CHIANG ;   et al.
2008-10-23
Fiber waveguide optical subassembly module
Grant 7,409,124 - Tsai , et al. August 5, 2
2008-08-05
Projector
App 20080174740 - Chou; Ming-Chieh ;   et al.
2008-07-24
Electrode and method for forming the same
App 20070080462 - Hu; Ying-Chiang ;   et al.
2007-04-12
Parallel optical subassembly module structure
Grant 7,198,413 - Kao , et al. April 3, 2
2007-04-03
Flexible biomonitor
App 20060211936 - Hu; Ying-Chiang ;   et al.
2006-09-21
Fiber waveguide optical subassembly module
App 20060110106 - Tsai; Ming-Lang ;   et al.
2006-05-25
Parallel optical subassembly module structure
App 20050185896 - Kao, Chih-Ting ;   et al.
2005-08-25

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