| Patent | Date |
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Electronic device including a substrate having interconnects
Grant 11,348,865 - Akkinepally , et al. May 31, 2 | 2022-05-31 |
Package-integrated vertical capacitors and methods of assembling same
Grant 11,296,186 - Marin , et al. April 5, 2 | 2022-04-05 |
Embedded Multi-die Interconnect Bridge Having A Molded Region With Through-mold Vias
App 20220093515 - Akkinepally; Praneeth Kumar ; et al. | 2022-03-24 |
High density package substrate formed with dielectric bi-layer
Grant 11,276,634 - Pietambaram , et al. March 15, 2 | 2022-03-15 |
Embedded multi-die interconnect bridge having a molded region with through-mold vias
Grant 11,233,009 - Akkinepally , et al. January 25, 2 | 2022-01-25 |
Magnetic Material Having Coated Ferromagnetic Filler Particles
App 20220005638 - Marin; Brandon C. ; et al. | 2022-01-06 |
Magnetic material having coated ferromagnetic filler particles
Grant 11,158,444 - Marin , et al. October 26, 2 | 2021-10-26 |
Embedded Multi-die Interconnect Bridge Having A Molded Region With Through-mold Vias
App 20210305163 - Akkinepally; Praneeth Kumar ; et al. | 2021-09-30 |
Package Architecture Utilizing Photoimageable Dielectric (pid) For Reduced Bump Pitch
App 20210134727 - May; Robert A. ; et al. | 2021-05-06 |
Electronic Device Including A Substrate
App 20210098356 - Akkinepally; Praneeth ; et al. | 2021-04-01 |
Capacitors With Nanoislands On Conductive Plates
App 20210066447 - PIETAMBARAM; Srinivas ; et al. | 2021-03-04 |
Microelectronic Assemblies Having Conductive Structures With Different Thicknesses
App 20200253037 - Kind Code | 2020-08-06 |
Package-integrated Vertical Capacitors And Methods Of Assembling Same
App 20200144359 - Marin; Brandon C. ; et al. | 2020-05-07 |
Selective Deposition Of Embedded Thin-film Resistors For Semiconductor Packaging
App 20200083164 - MARIN; Brandon C. ; et al. | 2020-03-12 |
High Density Package Substrate Formed With Dielectric Bi-layer
App 20200075473 - Pietambaram; Srinivas V. ; et al. | 2020-03-05 |
Package-integrated vertical capacitors and methods of assembling same
Grant 10,546,916 - Marin , et al. Ja | 2020-01-28 |
Package-integrated Vertical Capacitors And Methods Of Assembling Same
App 20200006468 - Marin; Brandon C. ; et al. | 2020-01-02 |
Dielectric Film With Pressure Sensitive Microcapsules Of Adhesion Promoter
App 20190389179 - AKKINEPALLY; Praneeth ; et al. | 2019-12-26 |
Dual Side De-bonding In Component Carriers Using Photoablation
App 20190287841 - Truong; Frank ; et al. | 2019-09-19 |
Magnetic Material Having Coated Ferromagnetic Filler Particles
App 20190252102 - Marin; Brandon C. ; et al. | 2019-08-15 |
Build-up high-aspect ratio opening
Grant 10,111,338 - Truong , et al. October 23, 2 | 2018-10-23 |
Build-up High-aspect Ratio Opening
App 20180270953 - Truong; Frank ; et al. | 2018-09-20 |
Raster-planarized substrate interlayers and methods of planarizing same
Grant 10,068,776 - Truong , et al. September 4, 2 | 2018-09-04 |
Device and method for the implantation of active fixation medical leads
Grant 8,747,417 - Truong June 10, 2 | 2014-06-10 |
Implant tool for active fixation lead
Grant 8,170,692 - Truong , et al. May 1, 2 | 2012-05-01 |
Device And Method For The Implantation Of Active Fixation Medical Leads
App 20100217277 - Truong; Frank | 2010-08-26 |
Implant Tool For Active Fixation Lead
App 20100137878 - Truong; Frank ; et al. | 2010-06-03 |
Systems and methods for gathering, organizing and executing test cases
Grant 7,590,973 - Barry , et al. September 15, 2 | 2009-09-15 |
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