Truessel; Dominik
Patent Applications and Registrations
Patent applications and USPTO patent grants for Truessel; Dominik.The latest application filed is for "power semiconductor module with injection-molded or laminated cooler assembly".
- Truessel; Dominik - Bremgarten CH
| Patent | Date |
|---|---|
| Power Semiconductor Module with Injection-Molded or Laminated Cooler Assembly App 20220301979 - Pavlicek; Niko ; et al. | 2022-09-22 |
| Power semiconductor module Grant 11,127,671 - Hartmann , et al. September 21, 2 | 2021-09-21 |
| Power Semiconductor Module App 20210233831 - Maleki; Milad ; et al. | 2021-07-29 |
| Interconnecting member for power module Grant 11,031,323 - Hartmann , et al. June 8, 2 | 2021-06-08 |
| Power semiconductor module Grant 10,854,524 - Guillon , et al. December 1, 2 | 2020-12-01 |
| Power Semiconductor Module App 20200112111 - Truessel; Dominik ; et al. | 2020-04-09 |
| Interconnecting Member For Power Module App 20190393135 - Hartmann; Samuel ; et al. | 2019-12-26 |
| Power Semiconductor Module App 20190363029 - Guillon; David ; et al. | 2019-11-28 |
| Power Semiconductor Module App 20190279927 - Hartmann; Samuel ; et al. | 2019-09-12 |
| Electrical conductor Grant 8,410,368 - Hartmann , et al. April 2, 2 | 2013-04-02 |
| Semiconductor module Grant 8,013,435 - Truessel , et al. September 6, 2 | 2011-09-06 |
| Electrical Conductor App 20110011620 - HARTMANN; Samuel ; et al. | 2011-01-20 |
| Semiconductor Module App 20100117223 - TRUESSEL; Dominik ; et al. | 2010-05-13 |
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