Trovarelli; Octavio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Trovarelli; Octavio.The latest application filed is for "electrical through contact".

Company Profile

0.11.14

Trovarelli; Octavio - Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical through contact Grant 8,124,521 - Hedler , et al. February 28, 2	2012-02-28
Method for applying solder to redistribution lines Grant 7,906,421 - Trovarelli , et al. March 15, 2	2011-03-15
Process for producing layer structures for signal distribution Grant 7,393,782 - Brintzinger , et al. July 1, 2	2008-07-01
Method for producing a rewiring printed circuit board Grant 7,390,742 - Brintzinger , et al. June 24, 2	2008-06-24
Electronic component with compliant elevations having electrical contact areas and method for producing it Grant 7,368,375 - Brintzinger , et al. May 6, 2	2008-05-06
Method for improving the mechanical properties of BOC module arrangements Grant 7,332,430 - Brintzinger , et al. February 19, 2	2008-02-19
Electrical Through Contact App 20080029850 - Hedler; Harry ; et al.	2008-02-07
Method for Applying Solder to Redistribution Lines App 20070298602 - Trovarelli; Octavio ; et al.	2007-12-27
Process for producing metallic interconnects and contact surfaces on electronic components Grant 7,271,095 - Brintzinger , et al. September 18, 2	2007-09-18
Arrangement and process for protecting fuses/anti-fuses Grant 7,235,859 - Brintzinger , et al. June 26, 2	2007-06-26
Method for fabricating metallic interconnects on electronic components Grant 7,172,966 - Brintzinger , et al. February 6, 2	2007-02-06
Connection between a semiconductor chip and an external conductor structure and method for producing it Grant 7,169,647 - Trovarelli , et al. January 30, 2	2007-01-30
Method for attaching dice to a package and arrangement of dice in a package App 20060270104 - Trovarelli; Octavio ; et al.	2006-11-30
Method for protecting the redistribution layer on wafers/chips Grant 7,115,496 - Brintzinger , et al. October 3, 2	2006-10-03
Method for producing a rewiring printed circuit board App 20060121257 - Brintzinger; Axel ; et al.	2006-06-08
Arrangement for reducing the electrical crosstalk on a chip App 20050275085 - Brintzinger, Axel ; et al.	2005-12-15
Process for producing a chip arrangement provided with a molding compound App 20050277230 - Brintzinger, Axel ; et al.	2005-12-15
Arrangement and process for protecting fuses/anti-fuses App 20050258506 - Brintzinger, Axel ; et al.	2005-11-24
Process for producing layer structures for signal distribution App 20050191837 - Brintzinger, Axel ; et al.	2005-09-01
Method for fabricating metallic interconnects on electronic components App 20050186786 - Brintzinger, Axel ; et al.	2005-08-25
Process for producing metallic interconnects and contact surfaces on electronic components App 20050186772 - Brintzinger, Axel ; et al.	2005-08-25
Electronic component with compliant elevations having electrical contact areas and method for producing it App 20050127521 - Brintzinger, Axel ; et al.	2005-06-16
Method for improving the mechanical properties of BOC module arrangements App 20040259290 - Brintzinger, Axel ; et al.	2004-12-23
Connection between a semiconductor chip and an external conductor structure and method for producing it App 20040248341 - Trovarelli, Octavio ; et al.	2004-12-09
Method for protecting the redistribution layer on wafers/chips App 20040248343 - Brintzinger, Axel ; et al.	2004-12-09

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