Trombley; Henry W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Trombley; Henry W..The latest application filed is for "solutions for modeling spatially correlated variations in an integrated circuit".

Company Profile

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Trombley; Henry W. - Starksboro VT
Trombley; Henry W. - Scarboru VT
Trombley; Henry W. - Bristol VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solutions for modeling spatially correlated variations in an integrated circuit Grant 8,903,697 - Trombley , et al. December 2, 2	2014-12-02
Solutions For Modeling Spatially Correlated Variations In An Integrated Circuit App 20130073266 - Trombley; Henry W. ; et al.	2013-03-21
Extracting consistent compact model parameters for related devices Grant 8,010,930 - Trombley , et al. August 30, 2	2011-08-30
Methods to select golden devices for device model extractions Grant 7,818,074 - Trombley , et al. October 19, 2	2010-10-19
IC chip parameter modeling Grant 7,783,466 - Jones , et al. August 24, 2	2010-08-24
Extracting Consistent Compact Model Parameters for Related Devices App 20100169849 - Trombley; Henry W. ; et al.	2010-07-01
Methods To Select Golden Devices For Device Model Extractions App 20090210176 - Trombley; Henry W. ; et al.	2009-08-20
Ic Chip Parameter Modeling App 20080275675 - Jones; John R. ; et al.	2008-11-06
Modeling small mosfets using ensemble devices Grant 7,353,473 - Pino , et al. April 1, 2	2008-04-01
Modeling Small Mosfets Using Ensemble Devices App 20070261011 - Pino; Robinson E. ; et al.	2007-11-08
Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed Grant 6,762,108 - Gambino , et al. July 13, 2	2004-07-13
Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed App 20030025139 - Gambino, Jeffrey P. ; et al.	2003-02-06
Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed App 20020117703 - Gambino, Jeffrey P. ; et al.	2002-08-29
Anti-reflective coatings for spatial light modulators Grant 6,282,010 - Sulzbach , et al. August 28, 2	2001-08-28
Metal-insulator-metal capacitor for copper damascene process and method of forming the same Grant 6,259,128 - Adler , et al. July 10, 2	2001-07-10

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