Trevino; Richard Scott
Patent Applications and Registrations
Patent applications and USPTO patent grants for Trevino; Richard Scott.The latest application filed is for "high density chip level package for the packaging of integrated circuits and method to manufacture same".
- Trevino; Richard Scott - San Jose CA
| Patent | Date |
|---|---|
| High density chip level package for the packaging of integrated circuits and method to manufacture same Grant 6,953,999 - Strandberg , et al. October 11, 2 | 2005-10-11 |
| High density chip level package for the packaging of integrated circuits and method to manufacture same App 20050146033 - Strandberg, Jan I. ; et al. | 2005-07-07 |
| High density chip level package for the packaging of integrated circuits and method to manufacture same Grant 6,872,589 - Strandberg , et al. March 29, 2 | 2005-03-29 |
| High density chip level package for the packaging of integrated circuits and method to manufacture same App 20040155337 - Strandberg, Jan I. ; et al. | 2004-08-12 |
| High density substrate for the packaging of integrated circuits App 20030197285 - Strandberg, Jan I. ; et al. | 2003-10-23 |
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