Trautmann; Achim

Patent Applications and Registrations

Patent applications and USPTO patent grants for Trautmann; Achim.The latest application filed is for "method for producing a dielectric field plate in a substrate trench, a corresponding substrate, and a power transistor".

Company Profile

2.14.14

Trautmann; Achim - Leonberg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing a substrate, substrate, metal-oxide-semiconductor field-effect transistor with a substrate, micro-electromechanical system with a substrate, and motor vehicle Grant 10,636,901 - Trautmann , et al.	2020-04-28
MOS field-effect transistor and method for the production thereof Grant 10,608,105 - Grieb , et al.	2020-03-31
Particle sensor and method for manufacturing a particle sensor Grant 10,126,224 - Trautmann , et al. November 13, 2	2018-11-13
Method for producing a dielectric field plate in a substrate trench, a corresponding substrate, and a power transistor Grant 9,972,690 - Trautmann , et al. May 15, 2	2018-05-15
Method for Producing a Dielectric Field Plate in a Substrate Trench, a Corresponding Substrate, and a Power Transistor App 20170117369 - Trautmann; Achim ; et al.	2017-04-27
Method for Producing a Substrate, Substrate, Metal-Oxide-Semiconductor Field-Effect Transistor with a Substrate, Micro-Electromechanical System with a Substrate, and Motor Vehicle App 20160218208 - Trautmann; Achim ; et al.	2016-07-28
Particle Sensor And Method For Manufacturing A Particle Sensor App 20160195464 - Trautmann; Achim ; et al.	2016-07-07
Mos Field-effect Transistor And Method For The Production Thereof App 20160118494 - GRIEB; Michael ; et al.	2016-04-28
Semiconductor device having at least one contact, and manufacturing method for a semiconductor device having at least one contact Grant 9,202,702 - Schrey , et al. December 1, 2	2015-12-01
Piezoresistive micromechanical sensor component and corresponding measuring method Grant 9,110,090 - Neul , et al. August 18, 2	2015-08-18
Arrangement of two substrates having an SLID bond and method for producing such an arrangement Grant 9,111,787 - Trautmann , et al. August 18, 2	2015-08-18
Micromechanical Structure And Coresponding Manufacturing Method App 20140355094 - SCHORR; Nicolas ; et al.	2014-12-04
Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Grant 8,638,000 - Trautmann , et al. January 28, 2	2014-01-28
Piezoresistive Micromechanical Sensor Component and Corresponding Measuring Method App 20130098154 - Neul; Reinhard ; et al.	2013-04-25
Component having a silicon carbide coated via Grant 8,405,190 - Trautmann , et al. March 26, 2	2013-03-26
Semiconductor Device Having At Least One Contact, And Manufacturing Method For A Semiconductor Device Having At Least One Contact App 20120292641 - Schrey; Frederik ; et al.	2012-11-22
Micromechanical Method and Corresponding Assembly for Bonding Semiconductor Substrates and Correspondingly Bonded Semiconductor Chip App 20120280409 - Trautmann; Achim ; et al.	2012-11-08
Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components App 20120187509 - Gottfried; Knut ; et al.	2012-07-26
Component Having A Via, And A Method For Manufacturing Such A Component App 20120038049 - Trautmann; Achim ; et al.	2012-02-16
Arrangement of Two Substrates having an SLID Bond and Method for Producing such an Arrangement App 20110233750 - Trautmann; Achim ; et al.	2011-09-29
Composite Of At Least Two Semiconductor Substrates And A Production Method App 20100308475 - Trautmann; Achim ; et al.	2010-12-09

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