Tran; Tu-Anh N.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tran; Tu-Anh N..The latest application filed is for "coated bonding wire and methods for bonding using same".
- Tran; Tu-Anh N. - Austin TX US
| Patent | Date |
|---|---|
| Surface finish for wirebonding Grant 10,325,876 - Mathew , et al. | 2019-06-18 |
| Methods for forming semiconductor devices with stepped bond pads Grant 9,780,051 - Tran , et al. October 3, 2 | 2017-10-03 |
| Bond pad having a trench and method for forming Grant 9,515,034 - Safai , et al. December 6, 2 | 2016-12-06 |
| Electronic component package and method for forming same Grant 9,437,574 - Tran , et al. September 6, 2 | 2016-09-06 |
| Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure Grant 9,437,459 - Carpenter , et al. September 6, 2 | 2016-09-06 |
| Coated bonding wire and methods for bonding using same Grant 9,368,470 - Lee , et al. June 14, 2 | 2016-06-14 |
| Coated Bonding Wire And Methods For Bonding Using Same App 20160126208 - LEE; CHU-CHUNG ; et al. | 2016-05-05 |
| Integrated circuit package with voltage distributor Grant 9,331,046 - Lee , et al. May 3, 2 | 2016-05-03 |
| Structures for reducing corrosion in wire bonds Grant 9,324,675 - Carpenter , et al. April 26, 2 | 2016-04-26 |
| Copper ball bond interface structure and formation Grant 9,257,403 - Tran , et al. February 9, 2 | 2016-02-09 |
| Surface Finish For Wirebonding App 20150380376 - MATHEW; VARUGHESE ; et al. | 2015-12-31 |
| Aluminum Clad Copper Structure Of An Electronic Component Package App 20150318240 - CARPENTER; BURTON J. ; et al. | 2015-11-05 |
| Structures And Methods For Reducing Corrosion In Wire Bonds App 20150311173 - CARPENTER; BURTON J. ; et al. | 2015-10-29 |
| Systems And Methods For Multiple Ball Bond Structures App 20150303169 - Tran; Tu-Anh N. ; et al. | 2015-10-22 |
| Bond pad and passivation layer having a gap and method for forming Grant 9,111,755 - Tran , et al. August 18, 2 | 2015-08-18 |
| Bond Pad Having A Trench And Method For Forming App 20150194396 - SAFAI; Sohrab ; et al. | 2015-07-09 |
| Bond Pad Having A Trench And Method For Forming App 20150194395 - Safai; Sohrab ; et al. | 2015-07-09 |
| Methods For Forming Semiconductor Devices With Stepped Bond Pads App 20150171035 - TRAN; TU-ANH N. ; et al. | 2015-06-18 |
| Copper Ball Bond Interface Structure and Formation App 20150145148 - Tran; Tu-Anh N. ; et al. | 2015-05-28 |
| Electronic Component Package And Method For Forming Same App 20150090480 - TRAN; TU-ANH N. ; et al. | 2015-04-02 |
| Tin-based Wirebond Structures App 20140367859 - Carpenter; Burton J. ; et al. | 2014-12-18 |
| Integrated Circuit Package With Voltage Distributor App 20140308779 - LEE; Chu-Chung ; et al. | 2014-10-16 |
| Integrated circuit package with voltage distributor Grant 8,791,582 - Lee , et al. July 29, 2 | 2014-07-29 |
| Embedded electronic component Grant 8,556,159 - Tran , et al. October 15, 2 | 2013-10-15 |
| Embedded Electronic Component App 20130221076 - Tran; Tu-Anh N. ; et al. | 2013-08-29 |
| Power lead-on-chip ball grid array package Grant 8,129,226 - Johnston , et al. March 6, 2 | 2012-03-06 |
| Integrated Circuit Package With Voltage Distributor App 20120025401 - LEE; CHU-CHUNG ; et al. | 2012-02-02 |
| Power Lead-on-Chip Ball Grid Array Package App 20100270663 - Johnston; James P. ; et al. | 2010-10-28 |
| Integrated circuit having pads and input/output (I/O) cells Grant 7,808,117 - Vo , et al. October 5, 2 | 2010-10-05 |
| Integrated Circuit Having Pads And Input/output (i/o) Cells App 20070267748 - Tran; Tu-Anh N. ; et al. | 2007-11-22 |
| Semiconductor die having a protective periphery region and method for forming App 20070087067 - Yuan; Yuan ; et al. | 2007-04-19 |
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