Tozawa; Keiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tozawa; Keiichi.The latest application filed is for "mold clamping device".
- Tozawa; Keiichi - Nagano-ken JP
- TOZAWA; Keiichi - Tokyo JP
- Tozawa; Keiichi - Hanishina-gun JP
| Patent | Date |
|---|---|
| Mold clamping device Grant 11,338,488 - Yoda , et al. May 24, 2 | 2022-05-24 |
| Mold clamping device Grant 11,117,300 - Yoda , et al. September 14, 2 | 2021-09-14 |
| Mold Clamping Device App 20210114273 - YODA; Hozumi ; et al. | 2021-04-22 |
| Mold Clamping Device App 20200307051 - YODA; Hozumi ; et al. | 2020-10-01 |
| Method For Manufacturing Mesenchymal Cell Line Derived From Vertebrate Animal Adipose Tissue App 20200190474 - MATSUBARA; Yumiko ; et al. | 2020-06-18 |
| Mold attaching method to mold clamping device Grant 10,493,679 - Tozawa De | 2019-12-03 |
| Agent For Promoting Wound Healing Comprising Platelet-like Cell Co-expressing Platelet Surface Antigen And Mesenchymal Cell Surf App 20190269732 - MATSUBARA; Yumiko ; et al. | 2019-09-05 |
| Heating device of injection molding machine Grant 10,112,332 - Sakurada , et al. October 30, 2 | 2018-10-30 |
| Heating Device Of Injection Molding Machine App 20160114511 - SAKURADA; Yuichi ; et al. | 2016-04-28 |
| Mold Attaching Method To Mold Clamping Device App 20150298376 - TOZAWA; Keiichi | 2015-10-22 |
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