TOYOTA; Gen

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOYOTA; Gen.The latest application filed is for "manufacturing method of semiconductor device and semiconductor device".

Company Profile

2.10.14

TOYOTA; Gen - Yokkaichi Mie JP
Toyota; Gen - Oita Oita JP
Toyota; Gen - Yokohama JP
Toyota; Gen - Oita-shi JP
Toyota; Gen - Oita JP
Toyota; Gen - Yokohama-shi JP
Toyota; Gen - Uita JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing Method Of Semiconductor Device And Semiconductor Device App 20220077106 - TOYOTA; Gen	2022-03-10
Method for manufacturing semiconductor device Grant 10,818,501 - Shirono , et al. October 27, 2	2020-10-27
Method For Manufacturing Semiconductor Device App 20190362980 - SHIRONO; Takashi ; et al.	2019-11-28
Method of manufacturing semiconductor device Grant 9,935,232 - Toyota , et al. April 3, 2	2018-04-03
Method Of Manufacturing Semiconductor Device App 20160268469 - Toyota; Gen ; et al.	2016-09-15
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method Grant 8,292,694 - Togawa , et al. October 23, 2	2012-10-23
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method Grant 7,883,394 - Togawa , et al. February 8, 2	2011-02-08
Substrate Processing Method And Substrate Processing Apparatus App 20100255757 - SHIGETA; Atsushi ; et al.	2010-10-07
Substrate processing method and substrate processing apparatus Grant 7,767,472 - Shigeta , et al. August 3, 2	2010-08-03
Polishing apparatus and polishing method Grant 7,744,445 - Kubota , et al. June 29, 2	2010-06-29
Substrate Holding Mechanism, Substrate Polishing Apparatus And Substrate Polishing Method App 20100062691 - TOGAWA; Tetsuji ; et al.	2010-03-11
Polishing apparatus and polishing method App 20090017730 - Kubota; Takeo ; et al.	2009-01-15
Substrate Holding Mechanism, Substrate Polishing Apparatus And Substrate Polishing Method App 20080318503 - TOGAWA; Tetsuji ; et al.	2008-12-25
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method Grant 7,419,420 - Togawa , et al. September 2, 2	2008-09-02
Substrate processing method and substrate processing apparatus App 20070287364 - Shigeta; Atsushi ; et al.	2007-12-13
Method of processing a substrate App 20070178701 - Toyota; Gen ; et al.	2007-08-02
Method of processing a substrate Grant 7,241,205 - Toyota , et al. July 10, 2	2007-07-10
Method of processing a substrate Grant 7,217,662 - Toyota , et al. May 15, 2	2007-05-15
Substrate processing method and semiconductor device manufacturing method App 20070000873 - Kubota; Takeo ; et al.	2007-01-04
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method App 20060205323 - Togawa; Tetsuji ; et al.	2006-09-14
Substrate processing method and substrate processing apparatus Grant 7,014,529 - Kubota , et al. March 21, 2	2006-03-21
Substrate processing method and substrate processing apparatus App 20060019417 - Shigeta; Atsushi ; et al.	2006-01-26
Method of processing a substrate App 20050245174 - Toyota, Gen ; et al.	2005-11-03
Method of processing a substrate App 20050221615 - Toyota, Gen ; et al.	2005-10-06

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