loadpatents
Patent applications and USPTO patent grants for TOYOSHIMA; Toshiaki.The latest application filed is for "die casting machine, die casting machine equipped with dies, control device for die casting machine, and die casting process".
Patent | Date |
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Die Casting Machine, Die Casting Machine Equipped With Dies, Control Device For Die Casting Machine, And Die Casting Process App 20220193759 - MATSUZAWA; Shugo ;   et al. | 2022-06-23 |
Molding Machine App 20220118510 - TSUJI; Makoto ;   et al. | 2022-04-21 |
Die casting machine Grant 10,493,521 - Nakata , et al. De | 2019-12-03 |
Molding machine Grant 10,391,553 - Amezawa , et al. A | 2019-08-27 |
Molding Machine App 20180133786 - AMEZAWA; Hiroki ;   et al. | 2018-05-17 |
Molding apparatus Grant 9,884,364 - Abe , et al. February 6, 2 | 2018-02-06 |
Die Casting Machine App 20170326630 - NAKATA; KOUEI ;   et al. | 2017-11-16 |
Molding Apparatus App 20160001357 - ABE; Yuji ;   et al. | 2016-01-07 |
Injection Device And Molding Apparatus App 20150352764 - NAKAMURA; Daisuke ;   et al. | 2015-12-10 |
Clamping apparatus and molding machine Grant 7,429,169 - Tsuji , et al. September 30, 2 | 2008-09-30 |
Die opening and closing system and die opening and closing method Grant 7,399,436 - Tsuji , et al. July 15, 2 | 2008-07-15 |
Die clamping system Grant 7,371,061 - Tsuji , et al. May 13, 2 | 2008-05-13 |
Die Opening And Closing System And Die Opening And Closing Method App 20070071845 - TSUJI; Makoto ;   et al. | 2007-03-29 |
Die clamping system App 20070065534 - Tsuji; Makoto ;   et al. | 2007-03-22 |
Clamping Apparatus And Molding Machine App 20060263471 - Tsuji; Makoto ;   et al. | 2006-11-23 |
Injection system and casting method of die casting machine Grant 7,040,377 - Toyoshima , et al. May 9, 2 | 2006-05-09 |
Die casting machine Grant 6,953,079 - Suzuki , et al. October 11, 2 | 2005-10-11 |
Injection system and casting method of die casting machine App 20050028961 - Toyoshima, Toshiaki ;   et al. | 2005-02-10 |
Die casting machine App 20040099399 - Suzuki, Kazuhiro ;   et al. | 2004-05-27 |
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