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Toyoda; Toshihisa Patent Filings

Toyoda; Toshihisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Toyoda; Toshihisa.The latest application filed is for "polymer composition, method for producing non-stretched film, non-stretched film, heat seal material, and packing material".

Company Profile
0.2.2
  • Toyoda; Toshihisa - Minato-ku N/A JP
  • Toyoda; Toshihisa - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polymer composition
Grant 9,120,920 - Nakano , et al. September 1, 2
2015-09-01
Polymer Composition, Method For Producing Non-stretched Film, Non-stretched Film, Heat Seal Material, And Packing Material
App 20120108754 - Nakano; Shigenori ;   et al.
2012-05-03
Polymer Composition
App 20110071259 - Nakano; Shigenori ;   et al.
2011-03-24

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