TOYODA; Eiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOYODA; Eiji.The latest application filed is for "electrically conductive composition and biosensor".

Company Profile

10.47.58

TOYODA; Eiji - Osaka JP
Toyoda; Eiji - Ibaraki JP
TOYODA; Eiji - Ibaraki-shi Osaka
Toyoda; Eiji - Niigata N/A JP
- Ibaraki JP
Toyoda; Eiji - Niigata-Ken JP
Toyoda; Eiji - Kitakanbara-gun JP
Toyoda; Eiji - Hitachi JP
Toyoda; Eiji - Wako JP
Toyoda; Eiji - Toyota JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically Conductive Composition And Biosensor App 20220130569 - TOYODA; Eiji ; et al.	2022-04-28
Electrically conductive composition and biosensor Grant 11,217,360 - Toyoda , et al. January 4, 2	2022-01-04
Laminate patchable to living body Grant 11,090,405 - Toyoda , et al. August 17, 2	2021-08-17
Producing method of wired circuit board Grant 11,006,530 - Okumura , et al. May 11, 2	2021-05-11
Patchable Biosensor App 20200289058 - MORI; Shigeyasu ; et al.	2020-09-17
Electrically Conductive Composition And Biosensor App 20200286641 - TOYODA; Eiji ; et al.	2020-09-10
Biosensor App 20200187859 - YOSHIOKA; Ryoma ; et al.	2020-06-18
Laminate Patchable Living Body App 20190254880 - SUGIMOTO; Naoya ; et al.	2019-08-22
Laminate Patchable Living Body App 20190247534 - TOYODA; Eiji ; et al.	2019-08-15
Resin sheet for sealing electronic device and method for manufacturing electronic-device package Grant 10,297,470 - Shimizu , et al.	2019-05-21
Wired circuit board Grant 10,194,861 - Okumura , et al. Fe	2019-02-05
Producing Method Of Wired Circuit Board App 20180199443 - OKUMURA; Keisuke ; et al.	2018-07-12
Wired Circuit Board App 20180192948 - OKUMURA; Keisuke ; et al.	2018-07-12
Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package Grant 9,659,883 - Morita , et al. May 23, 2	2017-05-23
Resin Sheet For Sealing Electronic Device And Method For Manufacturing Electronic-device Package App 20160269000 - Shimizu; Yusaku ; et al.	2016-09-15
Thermally Curable Resin Sheet For Sealing Semiconductor Chip, And Method For Manufacturing Semiconductor Package App 20160211228 - Morita; Kosuke ; et al.	2016-07-21
Sealing Sheet, Method For Manufacturing Sealing Sheet, And Method For Manufacturing Electronic Component Package App 20160060450 - Toyoda; Eiji ; et al.	2016-03-03
Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device Grant 9,147,625 - Shimizu , et al. September 29, 2	2015-09-29
Label sheet for cleaning and conveying member having cleaning function Grant 9,131,829 - Namikawa , et al. September 15, 2	2015-09-15
Silicon wafer and method for heat-treating silicon wafer Grant 8,999,864 - Senda , et al. April 7, 2	2015-04-07
Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation Grant 8,938,878 - Toyoda , et al. January 27, 2	2015-01-27
Thermosetting encapsulation adhesive sheet Grant 8,922,031 - Toyoda , et al. December 30, 2	2014-12-30
Thermosetting encapsulation adhesive sheet Grant 08922031 -	2014-12-30
Sealing resin sheet, method for producing electronic component package and electronic component package Grant 8,912,669 - Toyoda , et al. December 16, 2	2014-12-16
Method for producing semiconductor device Grant 8,906,746 - Oda , et al. December 9, 2	2014-12-09
Label Sheet For Cleaning And Conveying Member Having Cleaning Function App 20140311666 - NAMIKAWA; Makoto ; et al.	2014-10-23
Label Sheet For Cleaning And Conveying Member Having Cleaning Function App 20140311525 - NAMIKAWA; Makoto ; et al.	2014-10-23
Thermally-detachable Sheet App 20140249269 - Uenda; Daisuke ; et al.	2014-09-04
Laminate App 20140106133 - Torinari; Tsuyoshi ; et al.	2014-04-17
Thermosetting Resin Sheet For Sealing Electronic Component, Resin-sealed Type Semiconductor Device, And Method For Producing Resin-sealed Type Semiconductor Device App 20140061955 - Shimizu; Yusaku ; et al.	2014-03-06
Resin Sheet For Sealing Electronic Component, Resin-sealed Type Semiconductor Device And Method For Producing Resin-sealed Type Semiconductor Device App 20140042645 - Shimizu; Yusaku ; et al.	2014-02-13
Sealing Resin Sheet, Method For Producing Electronic Component Package And Electronic Component Package App 20140008821 - Toyoda; Eiji ; et al.	2014-01-09
Method for producing semiconductor device Grant 8,580,619 - Oda , et al. November 12, 2	2013-11-12
Method For Producing Semiconductor Device App 20130288428 - Oda; Takashi ; et al.	2013-10-31
Resin Composition Sheet For Encapsulating Electronic Parts And Method Of Producing Electronic Part Apparatus Using The Sheet App 20130185934 - TOYODA; Eiji ; et al.	2013-07-25
Resin Sheet For Hollow Encapsulation And Production Method For The Sheet, And Production Method For Hollow Electronic Part Apparatus And Hollow Electronic Part Apparatus App 20130183469 - SHIMIZU; Yusaku ; et al.	2013-07-18
Mobile Terminal Power Receiving Module Utilizing Wireless Power Transmission And Mobile Terminal Rechargable Battery Including Mobile Terminal Power Receiving Module App 20130175984 - Yamazaki; Hiroshi ; et al.	2013-07-11
Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process Grant 8,476,149 - Isogai , et al. July 2, 2	2013-07-02
Method Of Manufacturing Semiconductor Device App 20130157419 - Shimizu; Yusaku ; et al.	2013-06-20
Conductive Adhesive Sheet, Method For Producing The Same, Collector Electrode, And Solar Cell Module App 20130139874 - YAMAZAKI; Hiroshi ; et al.	2013-06-06
Method For Producing Semiconductor Device App 20130078769 - Oda; Takashi ; et al.	2013-03-28
Method For Producing Semiconductor Device App 20130078770 - Oda; Takashi ; et al.	2013-03-28
Method for heat treating a silicon wafer Grant 8,399,341 - Senda , et al. March 19, 2	2013-03-19
Field effect transistor and method for manufacturing the same Grant 8,389,347 - Tezuka , et al. March 5, 2	2013-03-05
Encapsulating Sheet And Electronic Device App 20120296010 - SHIMIZU; Yuusaku ; et al.	2012-11-22
Resin Kneaded Material And Sheet App 20120295997 - TORINARI; Tsuyoshi ; et al.	2012-11-22
Field effect transistor and method for manufacturing the same Grant 8,304,817 - Tezuka , et al. November 6, 2	2012-11-06
Manufacturing method for semiconductor device Grant 8,298,872 - Oda , et al. October 30, 2	2012-10-30
Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same Grant 8,269,213 - Noro , et al. September 18, 2	2012-09-18
Method of heat treating silicon wafer Grant 8,252,700 - Senda , et al. August 28, 2	2012-08-28
Method For Heat Treating A Silicon Wafer App 20120184091 - Senda; Takeshi ; et al.	2012-07-19
Thermosetting Encapsulation Adhesive Sheet App 20120153513 - Toyoda; Eiji ; et al.	2012-06-21
Silicon Wafer And Method For Heat-treating Silicon Wafer App 20120139088 - Senda; Takeshi ; et al.	2012-06-07
Method For Manufacturing Electronic Parts Device And Resin Composition For Electronic Parts Encapsulation App 20120055015 - TOYODA; Eiji ; et al.	2012-03-08
Label Sheet For Cleaning And Conveying Member Having Cleaning Function App 20110229697 - NAMIKAWA; Makoto ; et al.	2011-09-22
Label Sheet For Cleaning And Conveying Member Having Cleaning Function App 20110229675 - NAMIKAWA; Makoto ; et al.	2011-09-22
Manufacturing method for silicon wafer Grant 7,977,219 - Isogai , et al. July 12, 2	2011-07-12
Field effect transistor and method for manufacturing the same App 20110163355 - Tezuka; Tsutomu ; et al.	2011-07-07
Field effect transistor and method for manufacturing the same App 20110165738 - Tezuka; Tsutomu ; et al.	2011-07-07
Manufacturing Method For Semiconductor Device App 20110143501 - ODA; Takashi ; et al.	2011-06-16
Field effect transistor and method for manufacturing the same Grant 7,923,314 - Tezuka , et al. April 12, 2	2011-04-12
Cleaning Sheet, Conveying Member Using The Same, And Substrate Processing Equipment Cleaning Method Using Them App 20100319151 - Namikawa; Makoto ; et al.	2010-12-23
Cleaning sheet and method of cleaning substrate processing equipment Grant 7,846,258 - Terada , et al. December 7, 2	2010-12-07
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them Grant 7,793,668 - Namikawa , et al. September 14, 2	2010-09-14
Method of heat treating silicon wafer App 20100197146 - Senda; Takeshi ; et al.	2010-08-05
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Produced By Using The Same App 20100148379 - Noro; Hiroshi ; et al.	2010-06-17
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them Grant 7,713,356 - Namikawa , et al. May 11, 2	2010-05-11
Manufacturing Method For Silicon Wafer App 20100055884 - Isogai; Hiromichi ; et al.	2010-03-04
Silicon Wafer, Method For Manufacturing The Same And Method For Heat-treating The Same App 20100038757 - Isogai; Hiromichi ; et al.	2010-02-18
Cleaning member and cleaning method Grant 7,615,288 - Terada , et al. November 10, 2	2009-11-10
Field Effect Transistor and Method for Manufacturing the Same App 20090090934 - TEZUKA; Tsutomu ; et al.	2009-04-09
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Grant 7,501,711 - Eto , et al. March 10, 2	2009-03-10
Method Of Manufacturing Semiconductor Substrate App 20090004825 - SENDA; Takeshi ; et al.	2009-01-01
Thermosetting Encapsulation Adhesive Sheet App 20080286562 - Toyoda; Eiji ; et al.	2008-11-20
Semiconductor Substrate And Manufacturing Method Thereof App 20080164572 - Toyoda; Eiji ; et al.	2008-07-10
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same App 20080136048 - Eto; Takuya ; et al.	2008-06-12
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby Grant 7,268,191 - Toyoda , et al. September 11, 2	2007-09-11
Cleaning sheet and method for cleaning substrate processing apparatus App 20060151004 - Terada; Yoshio ; et al.	2006-07-13
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them App 20060105164 - Namikawa; Makoto ; et al.	2006-05-18
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them App 20050244632 - Namikawa, Makoto ; et al.	2005-11-03
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby App 20050154152 - Toyoda, Eiji ; et al.	2005-07-14
Cleaning member and cleaning method App 20040265594 - Terada, Yoshio ; et al.	2004-12-30
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them Grant 6,821,620 - Namikawa , et al. November 23, 2	2004-11-23
Label sheet for cleaning and conveying member having cleaning function App 20040007252 - Namikawa, Makoto ; et al.	2004-01-15
Organic electroluminescence device and method for producing the same Grant 6,652,700 - Namikawa , et al. November 25, 2	2003-11-25
Method for removing resist material Grant 6,638,864 - Toyoda , et al. October 28, 2	2003-10-28
Cleaning sheet , conveying member using the same, and substrate processing equipment cleaning method using them App 20030180532 - Namikawa, Makoto ; et al.	2003-09-25
Low-staining adhesive sheets and method for removing resist material Grant 6,602,599 - Toyoda , et al. August 5, 2	2003-08-05
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them App 20030136430 - Namikawa, Makoto ; et al.	2003-07-24
Method for removing resist material App 20020173151 - Toyoda, Eiji ; et al.	2002-11-21
Adhesive tape and process for removing resist App 20020100553 - Toyoda, Eiji	2002-08-01
Process for the removal of resist material App 20010015259 - Toyoda, Eiji ; et al.	2001-08-23
Process for the removal of resist material Grant 6,245,188 - Toyoda , et al. June 12, 2	2001-06-12
Resist removing apparatus and method Grant 6,235,144 - Yamamoto , et al. May 22, 2	2001-05-22
Process and apparatus for the removal of resist Grant 6,040,110 - Shirai , et al. March 21, 2	2000-03-21
Deceleration apparatus for motor and drive circuit for use in motor deceleration apparatus or control apparatus for use in sewing machine Grant 5,151,637 - Takada , et al. September 29, 1	1992-09-29
Permanent magnet reversible synchronous motor Grant 5,038,065 - Matsubayashi , et al. August 6, 1	1991-08-06
Superconducting system and method for controlling the same Grant 4,713,722 - Toyoda , et al. December 15, 1	1987-12-15
Internal combustion engine Grant 3,908,606 - Toyoda , et al. September 30, 1	1975-09-30
Shift Control System For Automatic Transmission Grant 3,747,438 - Toyoda , et al. July 24, 1	1973-07-24

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