Toyama; Naotaka
Patent Applications and Registrations
Patent applications and USPTO patent grants for Toyama; Naotaka.The latest application filed is for "method for manufacturing polishing pad, polishing pad, and method for polishing wafer".
- Toyama; Naotaka - Gunma JP
- Toyama; Naotaka - Gumma-gun JP
| Patent | Date |
|---|---|
| Method for manufacturing polishing pad, and method for polishing wafer Grant 8,287,331 - Kanaya , et al. October 16, 2 | 2012-10-16 |
| Method for manufacturing polishing pad, polishing pad, and method for polishing wafer App 20080248728 - Kanaya; Koichi ; et al. | 2008-10-09 |
| Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece Grant 6,422,922 - Okamura , et al. July 23, 2 | 2002-07-23 |
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