TOYAMA; Kohei

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOYAMA; Kohei.The latest application filed is for "vehicle-mounted sensor cleaning device".

Company Profile

3.6.5

TOYAMA; Kohei - Kariya-city JP
Toyama, Kohei - Fukushima JP
TOYAMA, KOHEI - FUKUSHIMA-KEN JP
Toyama; Kohei - Shirakawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vehicle-mounted Sensor Cleaning Device App 20210009088 - HAYASHI; Yuji ; et al.	2021-01-14
Lidar Apparatus App 20200355800 - TOYAMA; Kohei ; et al.	2020-11-12
Lidar Device App 20200348400 - TOYAMA; Kohei ; et al.	2020-11-05
Packaging bag for semiconductor wafer and method of packaging semiconductor wafer using the packaging bag App 20020153526 - Toyama, Kohei ; et al.	2002-10-24
Method And Apparatus For Lapping Or Polishing Semiconductor Silicon Single Crystal Wafer App 20010008801 - TOYAMA, KOHEI	2001-07-19
Recovery of coolant and abrasive grains used in slicing semiconductor wafers Grant 6,001,265 - Toyama , et al. December 14, 1	1999-12-14
Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing Grant 5,937,844 - Kiuchi , et al. August 17, 1	1999-08-17
Method of slicing semiconductor single crystal ingot Grant 5,875,769 - Toyama , et al. March 2, 1	1999-03-02
System for reusing oily slurry waste fluid Grant 5,830,369 - Toyama November 3, 1	1998-11-03
Wire saw slicing apparatus and slicing method using the same Grant 5,778,869 - Toyama July 14, 1	1998-07-14
Cutting fluid, method for production thereof, and method for cutting ingot Grant 5,693,596 - Kaburagi , et al. December 2, 1	1997-12-02

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