Touch Micro-System Technology Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Touch Micro-System Technology Inc..The latest application filed is for "interposer for connecting plurality of chips and method for manufacturing the same".

Company Profile

0.36.0

Touch Micro-System Technology Inc. - Taoyuan Hsien TW
Touch Micro-System Technology Inc. - Yang-Mei Taoyuan Hsien TW
Touch Micro-System Technology Inc. - Yangmei Township Taoyuan County TW
Touch Micro-System Technology Inc. - Taoyuan County TW
Touch Micro-System Technology Inc. - Yang-Moi Taoyuan Hsien TW
Touch Micro-System Technology Inc. - Taoyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interposer for connecting plurality of chips and method for manufacturing the same Grant 7,987,588 - Huang , et al. August 2, 2	2011-08-02
Light emitting diode structure Grant 7,821,094 - Lin , et al. October 26, 2	2010-10-26
Method of fabricating metal interconnects and inter-metal dielectric layer thereof Grant 7,795,131 - Huang , et al. September 14, 2	2010-09-14
White LED package structure having a silicon substrate and method of making the same Grant 7,741,772 - Lin , et al. June 22, 2	2010-06-22
Method of fabricating a hinge Grant 7,674,392 - Ho March 9, 2	2010-03-09
Wafer-level packaging cutting method capable of protecting contact pads Grant 7,622,334 - Tsai , et al. November 24, 2	2009-11-24
Method for wafer level packaging and fabricating cap structures Grant 7,598,125 - Shao , et al. October 6, 2	2009-10-06
Method of fabricating a diaphragm of a capacitive microphone device Grant 7,585,417 - Ho September 8, 2	2009-09-08
Method for wafer level chip scale packaging with passive components integrated into packaging structure Grant 7,582,511 - Yang September 1, 2	2009-09-01
Method of performing a double-sided process Grant 7,566,574 - Yang July 28, 2	2009-07-28
Micro sample heating apparatus and method of making the same Grant 7,533,564 - Pan , et al. May 19, 2	2009-05-19
Method of fabricating suspended structure Grant 7,531,457 - Kang , et al. May 12, 2	2009-05-12
Method of fabricating optical device caps Grant 7,528,000 - Tsai May 5, 2	2009-05-05
Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS device Grant 7,514,287 - Huang , et al. April 7, 2	2009-04-07
Method for wafer level packaging and fabricating cap structures Grant 7,510,947 - Shao , et al. March 31, 2	2009-03-31
Light emitting diode structure and manufacturing method thereof Grant 7,510,892 - Lin , et al. March 31, 2	2009-03-31
Wafer carrier Grant 7,505,118 - Yang March 17, 2	2009-03-17
Method of wafer level packaging and cutting Grant 7,470,565 - Wang December 30, 2	2008-12-30
Method of forming suspended structure Grant 7,465,601 - Kang , et al. December 16, 2	2008-12-16
Method of fabricating microphone device and thermal oxide layer and low-stress structural layer thereof Grant 7,456,043 - Lin , et al. November 25, 2	2008-11-25
Method of manufacturing suspension structure Grant 7,432,208 - Kang October 7, 2	2008-10-07
Method of edge bevel rinse Grant 7,413,963 - Huang , et al. August 19, 2	2008-08-19
Method of fabricating suspended structure Grant 7,410,821 - Chow , et al. August 12, 2	2008-08-12
Micro sample heating apparatus and method of making the same Grant 7,395,706 - Pan , et al. July 8, 2	2008-07-08
Method of fabricating microconnectors Grant 7,393,774 - Chiu July 1, 2	2008-07-01
Method of calibrating zero offset of a pressure sensor Grant 7,392,687 - Huang , et al. July 1, 2	2008-07-01
Method of manufacturing suspension structure and chamber Grant 7,393,784 - Kang July 1, 2	2008-07-01
Method for wafer-level package Grant 7,361,284 - Chen April 22, 2	2008-04-22
Method of performing a double-sided process Grant 7,306,955 - Yang December 11, 2	2007-12-11
Method of segmenting a wafer Grant 7,297,610 - Yang November 20, 2	2007-11-20
Method of forming a wear-resistant dielectric layer Grant 7,262,078 - Lai , et al. August 28, 2	2007-08-28
Method of fabricating a diaphragm of a capacitive microphone device Grant 7,258,806 - Ho August 21, 2	2007-08-21
Method of double-sided etching Grant 7,256,128 - Yang August 14, 2	2007-08-14
Method of protecting wafer front pattern and method of performing double-sided process Grant 7,235,185 - Chen June 26, 2	2007-06-26
Method of etching cavities having different aspect ratios Grant 7,045,463 - Yang May 16, 2	2006-05-16
Method of forming a wafer backside interconnecting wire Grant 7,008,821 - Shao , et al. March 7, 2	2006-03-07

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