Toth; William J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Toth; William J..The latest application filed is for "system configured for applying multiple modifying agents to a substrate".
- Toth; William J. - Idaho Falls ID
- Toth; William J. - Parma OH
| Patent | Date |
|---|---|
| System configured for applying a modifying agent to a non-equidimensional substrate Grant 7,241,340 - Janikowski , et al. July 10, 2 | 2007-07-10 |
| System configured for applying multiple modifying agents to a substrate Grant 6,962,731 - Propp , et al. November 8, 2 | 2005-11-08 |
| System configured for applying multiple modifying agents to a substrate App 20040058085 - Propp, W. Alan ; et al. | 2004-03-25 |
| System configured for applying a modifying agent to a non-equidimensional substrate App 20040028764 - Janikowski, Stuart K. ; et al. | 2004-02-12 |
| System configured for applying multiple modifying agents to a substrate Grant 6,652,654 - Propp , et al. November 25, 2 | 2003-11-25 |
| System configured for applying a modifying agent to a non-equidimensional substrate Grant 6,623,686 - Janikowski , et al. September 23, 2 | 2003-09-23 |
| Metallized and plated laminates Grant 4,568,413 - Toth , et al. February 4, 1 | 1986-02-04 |
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