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TOTANI; Makoto Patent Filings

TOTANI; Makoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOTANI; Makoto.The latest application filed is for "flexible laminated board and multilayer circuit board".

Company Profile
1.14.11
  • TOTANI; Makoto - Kariya-shi JP
  • Totani; Makoto - Kariya JP
  • Totani, Makoto - Kariya-city JP
  • Totani; Makoto - Aichi JP
  • Totani; Makoto - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flexible Laminated Board And Multilayer Circuit Board
App 20210153348 - TACHIBANA; Eisuke ;   et al.
2021-05-20
Flexible Laminated Board And Multilayer Circuit Board
App 20170318670 - TACHIBANA; Eisuke ;   et al.
2017-11-02
Circuit board and circuit board connection structure
Grant 7,417,195 - Totani , et al. August 26, 2
2008-08-26
Equipment for bonding printed circuit boards
Grant 7,240,426 - Totani , et al. July 10, 2
2007-07-10
Compact pressure sensor with high corrosion resistance and high accuracy
Grant 7,242,065 - Kondo , et al. July 10, 2
2007-07-10
Pressure sensor
Grant 7,176,541 - Tanaka , et al. February 13, 2
2007-02-13
Compact pressure sensor with high corrosion resistance and high accuracy
Grant 7,168,326 - Toyoda , et al. January 30, 2
2007-01-30
Method for connecting printed circuit boards and connected printed circuit boards
Grant 7,080,445 - Miyake , et al. July 25, 2
2006-07-25
Pressure sensor
App 20050269654 - Tanaka, Hiroaki ;   et al.
2005-12-08
Connecting structure of printed circuit boards
Grant 6,966,482 - Totani , et al. November 22, 2
2005-11-22
Compact pressure sensor with high corrosion resistance and high accuracy
App 20050210993 - Toyoda, Inao ;   et al.
2005-09-29
Compact pressure sensor with high corrosion resistance and high accuracy
App 20050205950 - Kondo, Ichiharu ;   et al.
2005-09-22
Equipment and method for bonding printed circuit boards
App 20040211057 - Totani, Makoto ;   et al.
2004-10-28
Interconnection structure for interconnecting printed circuit boards
Grant 6,784,375 - Miyake , et al. August 31, 2
2004-08-31
Circuit board and circuit board connection structure
App 20040156583 - Totani, Makoto ;   et al.
2004-08-12
Connecting structure of printed circuit boards
App 20030098339 - Totani, Makoto ;   et al.
2003-05-29
Method for connecting printed circuit boards and connected printed circuit boards
App 20030079341 - Miyake, Toshihiro ;   et al.
2003-05-01
Method of manufacturing three-dimensional printed wiring board
Grant 6,499,217 - Yamada , et al. December 31, 2
2002-12-31
Method for interconnecting printed circuit boards and interconnection structure
App 20020189862 - Miyake, Toshihiro ;   et al.
2002-12-19
Method for interconnecting printed circuit boards and interconnection structure
Grant 6,449,836 - Miyake , et al. September 17, 2
2002-09-17
Connecting method and connecting structure of printed circuit boards
App 20020014518 - Totani, Makoto ;   et al.
2002-02-07
Electronic circuit module, electronic circuit module connecting structure and connecting member, and method for connecting the same
Grant 6,282,098 - Totani , et al. August 28, 2
2001-08-28
Wiring board and semiconductor device
Grant 6,038,135 - Higashiguchi , et al. March 14, 2
2000-03-14
Semiconductor device having terminals for heat radiation
Grant 6,023,098 - Higashiguchi , et al. February 8, 2
2000-02-08
Wiring substrate and semiconductor device
Grant 5,783,865 - Higashiguchi , et al. July 21, 1
1998-07-21

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