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Sputtering Apparatus And Sputtering Method
App 20220148863 - ISHIBASHI; Shota ; et al. | 2022-05-12 |
Film Forming Apparatus, Film Forming System, And Film Forming Method
App 20220081757 - Shinada; Masato ; et al. | 2022-03-17 |
Sputtering Apparatus And Film Forming Method
App 20220044920 - ABARRA; Einstein Noel ; et al. | 2022-02-10 |
Apparatus And Method For Performing Sputtering Process
App 20220025511 - SHINADA; Masato ; et al. | 2022-01-27 |
Film forming apparatus and film forming method
Grant 11,158,492 - Toshima , et al. October 26, 2 | 2021-10-26 |
Substrate Processing Method And Apparatus
App 20210305032 - ISHIBASHI; Shota ; et al. | 2021-09-30 |
Sputtering Apparatus
App 20210296103 - ISHIBASHI; Shota ; et al. | 2021-09-23 |
Film Forming Apparatus And Method
App 20210207261 - ISHIBASHI; Shota ; et al. | 2021-07-08 |
Film Formation Device And Film Formation Method
App 20210118653 - SHINADA; Masato ; et al. | 2021-04-22 |
Hard Mask And Hard Mask Forming Method
App 20200266063 - TOSHIMA; Hiroyuki ; et al. | 2020-08-20 |
Hard Mask And Semiconductor Device Manufacturing Method
App 20200227273 - TOSHIMA; Hiroyuki ; et al. | 2020-07-16 |
Methods To Reshape Spacer Profiles In Self-aligned Multiple Patterning
App 20200194261 - Ko; Akiteru ; et al. | 2020-06-18 |
Film-forming Device
App 20200071815 - TOSHIMA; Hiroyuki ; et al. | 2020-03-05 |
Film Forming Apparatus and Film Forming Method
App 20200048759 - SHINADA; Masato ; et al. | 2020-02-13 |
Film-forming Apparatus, Film-forming System, And Film-forming Method
App 20200051796 - SHINADA; Masato ; et al. | 2020-02-13 |
Film Forming Apparatus And Film Forming Method
App 20200043711 - Toshima; Hiroyuki ; et al. | 2020-02-06 |
Method for forming copper film
Grant 10,189,230 - Toshima , et al. Ja | 2019-01-29 |
Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrate
Grant 10,068,798 - Toshima , et al. September 4, 2 | 2018-09-04 |
Method For Forming Copper Film
App 20180001597 - TOSHIMA; Hiroyuki ; et al. | 2018-01-04 |
Method And Processing Apparatus For Performing Pre-treatment To Form Copper Wiring In Recess Formed In Substrate
App 20170372951 - TOSHIMA; Hiroyuki ; et al. | 2017-12-28 |
Processing Apparatus
App 20160071707 - FURUKAWA; Shinji ; et al. | 2016-03-10 |
Method for forming Cu wiring
Grant 9,064,690 - Ishizaka , et al. June 23, 2 | 2015-06-23 |
Method of forming copper wiring and method and system for forming copper film
Grant 8,859,422 - Ishizaka , et al. October 14, 2 | 2014-10-14 |
Method Of Forming Copper Wiring And Method And System For Forming Copper Film
App 20140287163 - ISHIZAKA; Tadahiro ; et al. | 2014-09-25 |
Plasma Processing Apparatus And Cleaning Method For Removing Metal Oxide Film
App 20140060572 - YASUMURO; Chiaki ; et al. | 2014-03-06 |
Method For Forming Cu Wiring
App 20140045329 - ISHIZAKA; Tadahiro ; et al. | 2014-02-13 |
Magnetron sputtering apparatus
Grant 8,617,363 - Mizuno , et al. December 31, 2 | 2013-12-31 |
Film Forming Method And Film Forming Apparatus
App 20130237053 - Ishizaka; Tadahiro ; et al. | 2013-09-12 |
Magnetron Sputtering Apparatus
App 20130105309 - Mizuno; Shigeru ; et al. | 2013-05-02 |
Magnetron Sputtering Apparatus And Method
App 20130081938 - MIZUNO; Shigeru ; et al. | 2013-04-04 |
Methods of forming copper wiring and copper film, and film forming system
Grant 8,399,353 - Ishizaka , et al. March 19, 2 | 2013-03-19 |
Semiconductor integrated circuit device having insulated through wires
Grant 8,384,207 - Toshima , et al. February 26, 2 | 2013-02-26 |
Film Forming Method, Resputtering Method, And Film Forming Apparatus
App 20120247949 - SAKUMA; Takashi ; et al. | 2012-10-04 |
Method Of Forming Copper Wiring And Method And System For Forming Copper Film
App 20120196052 - ISHIZAKA; Tadahiro ; et al. | 2012-08-02 |
Methods Of Forming Copper Wiring And Copper Film, And Film Forming System
App 20120196437 - ISHIZAKA; Tadahiro ; et al. | 2012-08-02 |
Plasma Processing Method And Plasma Processing Apparatus
App 20110017706 - Takahashi; Tetsuro ; et al. | 2011-01-27 |
Adhesive injection apparatus
Grant 7,594,805 - Miyakawa , et al. September 29, 2 | 2009-09-29 |
Semiconductor Integrated Circuit Device And Method For Manufacturing Same
App 20090114988 - Toshima; Hiroyuki ; et al. | 2009-05-07 |
Method And Apparatus For Manufacturing Semiconductor Device, And Storage Medium For Executing The Method
App 20080184543 - Sako; Takuji ; et al. | 2008-08-07 |
Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group
Grant 7,308,395 - Kaneko , et al. December 11, 2 | 2007-12-11 |
Adhesive injection apparatus and method
App 20060021706 - Miyakawa; Nobuaki ; et al. | 2006-02-02 |
Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group
App 20050075854 - Kaneko, Hisashi ; et al. | 2005-04-07 |
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