Tosa; Akifumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tosa; Akifumi.The latest application filed is for "multilayer heating body".

Company Profile

1.14.14

Tosa; Akifumi - Komaki JP
TOSA; Akifumi - Komaki-shi JP
Tosa; Akifumi - Aichi JP
Tosa; Akifumi - Konan JP
Tosa, Akifumi - Konan-shi JP
Tosa, Akifumi - Kounan JP
Tosa; Akifumi - Nagoya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer heating body Grant 11,013,068 - Tosa , et al. May 18, 2	2021-05-18
Multilayer Heating Body App 20170359859 - TOSA; Akifumi ; et al.	2017-12-14
Alumina sintered body, member including the same, and semiconductor manufacturing apparatus Grant 9,136,031 - Ito , et al. September 15, 2	2015-09-15
Alumina Sintered Body, Member Including The Same, And Semiconductor Manufacturing Apparatus App 20130285336 - ITO; Yoichi ; et al.	2013-10-31
Silicon nitride-melilite composite sintered body and device utilizing the same Grant 8,071,496 - Hara , et al. December 6, 2	2011-12-06
Wiring board and ceramic chip to be embedded Grant 7,956,454 - Yamamoto , et al. June 7, 2	2011-06-07
Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board Grant 7,778,010 - Sato , et al. August 17, 2	2010-08-17
Silicon Nitride-melilite Composite Sintered Body And Device Utilizing The Same App 20100130345 - HARA; Yasushi ; et al.	2010-05-27
Method Of Manufacturing Capacitor For Incorporation In Wiring Board, Capacitor For Incorporation In Wiring Board, And Wiring Board App 20090268373 - SATO; Motohiko ; et al.	2009-10-29
Wiring Board And Ceramic Chip To Be Embedded App 20090255719 - Yamamoto; Hiroshi ; et al.	2009-10-15
Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board Grant 7,573,697 - Sato , et al. August 11, 2	2009-08-11
Wiring board and ceramic chip to be embedded Grant 7,557,440 - Yamamoto , et al. July 7, 2	2009-07-07
Multilayer electronic component and method for producing the same Grant 7,362,560 - Tsujimura , et al. April 22, 2	2008-04-22
Capacitor and method for manufacturing the same Grant 7,233,480 - Hayashi , et al. June 19, 2	2007-06-19
Wiring board and ceramic chip to be embedded App 20070045814 - Yamamoto; Hiroshi ; et al.	2007-03-01
Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board App 20070047175 - Sato; Motohiko ; et al.	2007-03-01
Capacitor and method for manufacturing the same App 20060245142 - Hayashi; Kazuhiro ; et al.	2006-11-02
Method for producing ceramic substrate, and ceramic substrate Grant 7,105,070 - Tosa , et al. September 12, 2	2006-09-12
Capacitor and method for manufacturing the same Grant 7,072,169 - Hayashi , et al. July 4, 2	2006-07-04
Dielectric ceramic material Grant 6,995,106 - Oba , et al. February 7, 2	2006-02-07
Multilayer electronic component and method for producing the same App 20050269287 - Tsujimura, Yasuhiro ; et al.	2005-12-08
Capacitor and method for manufacturing the same App 20050122662 - Hayashi, Kazuhiro ; et al.	2005-06-09
Method for producing ceramic substrate, and ceramic substrate App 20050051253 - Tosa, Akifumi ; et al.	2005-03-10
Dielectric porcelain composition Grant 6,844,284 - Tosa , et al. January 18, 2	2005-01-18
Dielectric porcelain composition App 20030119657 - Tosa, Akifumi ; et al.	2003-06-26
Dielectric ceramic material App 20030109374 - Oba, Takashi ; et al.	2003-06-12
Dielectric porcelain composition and dielectric resonator using the same App 20030050179 - Itakura, Kazuhisa ; et al.	2003-03-13
Dielectric material, a method for producing the same and a dielectric resonator device comprising same Grant 6,117,806 - Yokoi , et al. September 12, 2	2000-09-12

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