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name:-0.012027978897095
name:-0.01459789276123
name:-0.0015969276428223
Tornello; James A. Patent Filings

Tornello; James A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tornello; James A..The latest application filed is for "indium phosphide smoothing and chemical mechanical planarization processes".

Company Profile
1.11.11
  • Tornello; James A. - Cortlandt Manor NY
  • Tornello; James A. - Cortland Manor NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Indium phosphide smoothing and chemical mechanical planarization processes
Grant 10,262,866 - Beveridge , et al.
2019-04-16
Indium Phosphide Smoothing And Chemical Mechanical Planarization Processes
App 20180166292 - Beveridge; Henry A. ;   et al.
2018-06-14
Indium phosphide smoothing and chemical mechanical planarization processes
Grant 9,916,985 - Beveridge , et al. March 13, 2
2018-03-13
Germanium smoothing and chemical mechanical planarization processes
Grant 9,890,300 - Kawamoto , et al. February 13, 2
2018-02-13
Germanium Smoothing And Chemical Mechanical Planarization Processes
App 20170218229 - Kawamoto; Tatsuyoshi ;   et al.
2017-08-03
Group III arsenide material smoothing and chemical mechanical planarization processes
Grant 9,646,841 - Beveridge , et al. May 9, 2
2017-05-09
Germanium smoothing and chemical mechanical planarization processes
Grant 9,646,842 - Kawamoto , et al. May 9, 2
2017-05-09
Germanium Smoothing And Chemical Mechanical Planarization Processes
App 20170110334 - Kawamoto; Tatsuyoshi ;   et al.
2017-04-20
Indium Phosphide Smoothing And Chemical Mechanical Planarization Processes
App 20170110332 - Beveridge; Henry A. ;   et al.
2017-04-20
Group Iii Arsenide Material Smoothing And Chemical Mechanical Planarization Processes
App 20170110333 - Beveridge; Henry A. ;   et al.
2017-04-20
High-yield method of exposing and contacting through-silicon vias
Grant 8,263,497 - Andry , et al. September 11, 2
2012-09-11
Glass mold polishing method and structure
Grant 7,955,160 - Cobb , et al. June 7, 2
2011-06-07
High-yield Method Of Exposing And Contacting Through-silicon Vias
App 20100178766 - Andry; Paul S. ;   et al.
2010-07-15
Glass Mold Polishing Method And Structure
App 20090305616 - Cobb; Michael A. ;   et al.
2009-12-10
Method of forming noble metal contacts
Grant 7,581,314 - Deligianni , et al. September 1, 2
2009-09-01
Noble metal contacts for micro-electromechanical switches
Grant 7,202,764 - Deligianni , et al. April 10, 2
2007-04-10
Materials and method to seal vias in silicon substrates
Grant 7,199,450 - Casey , et al. April 3, 2
2007-04-03
Materials And Method To Seal Vias In Silicon Substrates
App 20060255480 - Casey; Jon A. ;   et al.
2006-11-16
Noble metal contacts for micro-electromechanical switches
App 20060164194 - Deligianni; Hariklia ;   et al.
2006-07-27
Noble Metal Contacts For Micro-electromechanical Switches
App 20050007217 - Deligianni, Hariklia ;   et al.
2005-01-13
Slurry for mechanical polishing (CMP) of metals and use thereof
App 20030073593 - Brigham, Michael Todd ;   et al.
2003-04-17
Process to increase reliability CuBEOL structures
Grant 6,503,834 - Chen , et al. January 7, 2
2003-01-07

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